A3PE3000L-1FG484

The A3PE3000L-1FG484 is a ProASIC3L field programmable gate array (FPGA) in a 484-ball BGA package. It combines a high logic capacity, embedded memory, and a large I/O count in a surface-mount 484-FPBGA (23×23) footprint.

Designed for commercial-grade embedded designs, this device provides up to 3,000,000 gates, approximately 75,264 logic elements, and approximately 0.516 Mbits of on-chip RAM, with a 1.14 V to 1.575 V supply range and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity Up to 3,000,000 gates and 75,264 logic elements (cells) to support complex digital logic and high-density integration.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for register files, FIFOs, and other local storage needs.
• I/O Density 341 user I/O pins to support extensive peripheral connectivity and multi‑interface designs.
• Package 484-ball BGA, supplier device package 484-FPBGA (23×23), optimized for compact, high-density board layouts and surface-mount assembly.
• Power Operating supply range from 1.14 V to 1.575 V for low-voltage system integration.
• Thermal & Mounting Surface mount device with an operating temperature range of 0 °C to 85 °C suitable for commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital logic – Use the large logic element count and gate capacity to implement complex state machines, protocol engines, and glue logic.
• Memory‑centric functions – Approximately 0.516 Mbits of embedded RAM supports local buffering, FIFOs, and small data stores within the FPGA fabric.
• I/O‑rich systems – 341 I/O pins enable designs that require extensive peripheral connectivity and multiple parallel interfaces.

Unique Advantages

• Significant logic scale: 3,000,000 gates and 75,264 logic elements provide headroom for complex designs without external logic expansion.
• On-chip memory available: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for local buffering and control structures.
• High I/O count: 341 I/O pins support multiple interfaces and dense peripheral connectivity on a single device.
• Compact BGA package: 484-FPBGA (23×23) enables a space-efficient implementation for board designs that require a high pin count.
• Low-voltage operation: 1.14 V to 1.575 V supply compatibility for integration with modern low-voltage power domains.
• Commercial grade and RoHS compliant: Suited for a wide range of commercial electronic applications with environmental compliance.

Why Choose A3PE3000L-1FG484?

The A3PE3000L-1FG484 delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-BGA surface-mount package. Its specifications make it suitable for commercial embedded designs that demand substantial programmable logic and local memory while maintaining a low-voltage power profile.

Engineers and procurement teams will find this device appropriate for projects requiring scalability within a single FPGA, compact board implementation, and RoHS-compliant sourcing backed by a well-defined operating temperature and voltage range.

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