A3PE3000L-1FG896I

The A3PE3000L-1FG896I is a ProASIC3L field programmable gate array (FPGA) manufactured by Microchip Technology, offered in an 896‑ball BGA package. It provides a high-density, industrial‑grade programmable fabric suitable for designs requiring extensive logic capacity, high I/O count and on‑chip memory.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and up to 620 general-purpose I/O, this device targets industrial and board‑level applications that need significant integration while operating across a wide supply and temperature range.

Key Features

• Logic Capacity — 75,264 logic elements enabling implementation of complex custom logic and control functions.
• On‑Chip Memory — Approximately 0.516 Mbits of embedded RAM for buffering, state storage and small data structures.
• Gate Count — 3,000,000 gates to support large combinational and sequential designs.
• I/O Density — Up to 620 I/O pins to accommodate high‑pin‑count interfaces and multi‑channel connectivity.
• Power — Operates from a 1.14 V to 1.575 V supply range for core power planning and system integration.
• Package and Mounting — 896‑BGA (896‑FBGA, 31 × 31 mm) surface‑mount package suitable for compact board layouts.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for use in industrial environments.
• RoHS Compliant — Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control — Implement custom control logic and high‑density I/O interfaces for motor drives, PLCs and factory automation equipment.
• Communications Equipment — Provide protocol handling and I/O aggregation in infrastructure and backplane modules that require many signals and sizable logic resources.
• Test & Measurement — Enable flexible signal processing, trigger logic and interface adaptation in benchtop and automated test systems.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates support complex designs without external programmable logic.
• Substantial I/O Count: 620 available I/O pins reduce the need for additional interface components and simplify board routing for multi‑channel systems.
• On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and local data storage, lowering external memory dependency.
• Industrial‑Grade Operation: −40 °C to 100 °C rating and RoHS compliance make the device suitable for demanding production environments.
• Compact BGA Package: 896‑FBGA (31 × 31 mm) provides a high‑pin‑count solution in a space‑efficient footprint for PCB real estate savings.

Why Choose A3PE3000L-1FG896I?

The A3PE3000L-1FG896I balances high logic capacity, significant on‑chip memory and very high I/O density in an industrial‑rated, RoHS‑compliant BGA package from Microchip Technology. It is well suited for engineers designing industrial control, communications or test systems that require integrated programmable logic with broad I/O capability.

This device offers a clear integration path for board‑level designs that need to consolidate multiple functions into a single programmable component while meeting industrial temperature and environmental requirements.

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