A3PE3000L-1FG896M

The A3PE3000L-1FG896M is a military-grade ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It provides a high-density programmable logic resource with a large I/O count and embedded memory, packaged in a compact 896-BGA surface-mount package.

With MIL-STD-883 qualification and an extended operating range, this device is intended for defense and rugged applications that require robust temperature and qualification margins while leveraging programmable logic for system integration.

Key Features

• FPGA Core  Approximately 3,000,000 gates and 75,264 logic elements deliver substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• I/O Density  620 user I/Os for extensive external device interfacing and high-pin-count system consolidation.
• Power  Nominal supply voltage range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Package & Mounting  896-ball BGA package (supplier device package: 896-FBGA, 31×31) designed for surface-mount PCB assembly.
• Qualification & Temperature  Military grade with MIL-STD-883 qualification and an operating temperature range of −55 °C to 125 °C for deployment in harsh environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Military and Defense Systems  Use in MIL-STD-883 qualified electronic modules where rugged temperature performance and qualification are required.
• High-Density I/O Systems  Consolidating multiple interfaces or subsystems in a single programmable device thanks to 620 I/Os.
• Complex Logic Integration  Implementing large-scale custom logic functions and glue logic with 75,264 logic elements and 3,000,000 gates.

Unique Advantages

• Military-Grade Qualification:  MIL-STD-883 qualification and a −55 °C to 125 °C operating range support deployment in rugged and defense environments.
• High Logic Capacity:  75,264 logic elements and 3,000,000 gates provide headroom for complex, multi-function designs.
• Large I/O Count:  620 I/Os enable dense external connectivity, reducing the need for additional interface components.
• Embedded Memory:  Approximately 0.516 Mbits of on-chip RAM for local buffering and state retention without external memory.
• Compact, Surface-Mount Package:  896-FBGA (31×31) package supports high-density board layouts while maintaining manufacturability.
• Supplier Backing:  Manufactured by Microchip Technology, providing a recognized supplier for military-qualified programmable logic.

Why Choose A3PE3000L-1FG896M?

The A3PE3000L-1FG896M balances substantial programmable logic resources, high I/O count, and embedded memory with military-grade qualification and an extended temperature range. It is positioned for engineers designing rugged, fielded systems that require verified qualification and significant on-chip resources for consolidation and customization.

This device is a fit for customers needing a durable, high-capacity FPGA solution from a known supplier, enabling integration of complex logic functions and high-density interfacing in MIL-STD-883 qualified designs.

Request a quote or submit a pricing and availability inquiry to initiate evaluation and procurement of the A3PE3000L-1FG896M. Our team can provide further technical details and support for your design requirements.