A3PE3000L-1FGG484

The A3PE3000L-1FGG484 is a ProASIC3L FPGA from Microchip Technology provided in a 484-ball BGA (23×23) package. It delivers a sizeable programmable fabric with 75,264 logic elements and approximately 0.516 Mbits of embedded memory for custom digital logic implementations.

With up to 341 user I/Os, a 3,000,000-gate capacity and a 1.14 V to 1.575 V supply range, this device is suited to designs that require substantial logic resources and flexible I/O counts within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity — 3,000,000 gates and 75,264 logic elements provide a large programmable fabric for complex logic and control functions.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM to support buffering, state machines, and data processing tasks.
• I/O Density — Up to 341 user I/Os to interface with peripherals, sensors, and external buses.
• Power Supply — Operates from a 1.14 V to 1.575 V supply range, allowing integration with modern low-voltage system rails.
• Package and Mounting — 484-ball FPBGA (23×23) package, surface-mountable for compact board layouts.
• Operating Range and Grade — Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• RoHS Compliant — Device meets RoHS requirements for material compliance.

Typical Applications

• Embedded Systems — Implement custom control logic and peripheral interfaces using the device's 75,264 logic elements and extensive I/O.
• Communications and Networking — Use the FPGA fabric and on-chip memory for protocol handling, data buffering, and packet processing tasks.
• Consumer Electronics — Integrate flexible logic and I/O for feature-rich consumer devices that require programmable customization.
• Prototyping and System Integration — Leverage the device's gate count and I/O density for validating complex digital designs and system-level prototypes.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates enable implementation of sizable digital functions on a single device, reducing board-level complexity.
• Significant On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and local data storage without external memory components.
• Flexible I/O Count: Up to 341 user I/Os provide broad interfacing options for sensors, buses, and peripherals, simplifying system integration.
• Compact Surface-Mount Package: 484-ball FPBGA (23×23) enables dense PCB layouts while maintaining a robust soldered connection.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of non-industrial applications.
• Regulatory Compliance: RoHS compliance supports environmentally conscious assembly and manufacturing requirements.

Why Choose A3PE3000L-1FGG484?

The A3PE3000L-1FGG484 combines substantial logic and memory resources with a high I/O count in a compact 484-BGA package, making it a practical choice for designers who need scalable programmable logic in commercial-temperature systems. Its voltage range and packaging support integration into contemporary low-voltage designs while conserving board area.

As part of Microchip Technology’s ProASIC3L offering, this device is suitable for development teams and OEMs targeting complex digital functions, protocol handling, and system integration tasks that benefit from on-chip memory and flexible interfacing.

Request a quote or submit a purchase inquiry to check availability and lead times for the A3PE3000L-1FGG484. Technical documentation is available from the manufacturer to support evaluation and design integration.