A3PE3000L-1FGG896I

The A3PE3000L-1FGG896I is a ProASIC3L FPGA IC designed for industrial applications that require high logic density and extensive I/O. As a reprogrammable logic device, it integrates a large number of logic elements, on-chip embedded memory and a high I/O count to support complex digital designs.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory and up to 620 I/O, this device targets industrial control, communications and instrumentation applications that need substantial integration and robust operating range.

Key Features

• Core Logic  75,264 logic elements provide large-capacity programmable fabric for implementing complex state machines, datapaths and custom IP.
• Embedded Memory  Approximately 0.52 Mbits (516,096 bits) of on-chip RAM supports buffering, FIFOs and small look-up tables within the FPGA fabric.
• I/O Density  A high count of 620 I/O pins enables wide external interfacing and parallel connectivity for peripherals, sensors and buses.
• Gate Capacity  Approximately 3,000,000 gates for substantial logic and routing resources to map large designs.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.575 V to match system power architectures.
• Package & Mounting  Delivered in an 896‑ball BGA package (896‑FBGA, 31×31) and intended for surface-mount assembly for compact board integration.
• Operating Range  Industrial-grade operation from -40 °C to 100 °C to meet temperature demands in industrial environments.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  High logic capacity and 620 I/O support complex control algorithms, machine interfaces and I/O aggregation in industrial automation.
• Communications Equipment  Large logic element count and embedded RAM enable protocol processing, packet handling and custom interface logic in networking gear.
• Data Acquisition & Instrumentation  Extensive I/O and on-chip memory allow aggregation and preprocessing of sensor data and real-time signal controls.
• Custom Digital Systems  Reprogrammable fabric with 3,000,000 gates supports bespoke logic implementations and iterative design refinement for specialized systems.

Unique Advantages

• High I/O Density: 620 I/O pins provide extensive external connectivity, reducing the need for external multiplexing and simplifying board design.
• Large Programmable Capacity: 75,264 logic elements and roughly 3,000,000 gates enable dense logic integration for advanced digital functions.
• On‑Chip Memory: Approximately 0.52 Mbits of embedded RAM supports buffering and localized data storage to improve system responsiveness.
• Industrial Temperature Support: Rated for -40 °C to 100 °C operation to meet thermal requirements in demanding environments.
• Compact BGA Footprint: 896‑FBGA (31×31) package allows high pin count in a compact surface-mount form factor for space-constrained designs.
• RoHS Compliant: Conforms to lead-free requirements for environmentally conscious manufacturing processes.

Why Choose A3PE3000L-1FGG896I?

The A3PE3000L-1FGG896I positions itself as a high-density, industrial-grade FPGA solution combining a large number of logic elements, substantial embedded memory and a very high I/O count in a compact BGA package. Its electrical and thermal specifications make it suitable for designs that require robust operation across a wide temperature range and significant on-chip integration.

This device is well suited for engineering teams building advanced industrial control, communications, instrumentation or custom digital systems that benefit from a reprogrammable fabric, high I/O capacity and integrated memory resources. The combination of logic capacity, I/O density and RoHS compliance offers a scalable and manufacturable platform for long-term designs.

Request a quote or submit an inquiry to get pricing and availability information for the A3PE3000L-1FGG896I. Our team can assist with lead times and procurement details.