A3PE3000L-1PQ208

The A3PE3000L-1PQ208 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a 208-BFQFP surface-mount package. It provides a commercial-grade programmable logic platform with substantial on-chip resources for embedded digital designs.

With 75,264 logic elements, approximately 0.5 Mbits of embedded memory, 147 user I/Os and an internal gate count of 3,000,000, this device is intended for commercial applications that require high logic capacity in a compact QFP footprint and low-voltage operation.

Key Features

• Logic Capacity 75,264 logic elements (reported as logic element cells) enabling large-scale combinational and sequential logic implementations.
• Embedded Memory Approximately 0.5 Mbits of on-chip RAM (516,096 total bits) to support data buffering, FIFOs, and small local memories.
• I/O and Gate Count 147 user I/O pins and an internal count of 3,000,000 gates to accommodate complex interfacing and processing tasks.
• Low-Voltage Operation Operates from 1.14 V to 1.575 V, suitable for designs targeting lower core supply domains.
• Package and Mounting 208-BFQFP (208-PQFP, 28 × 28 mm) surface-mount package for board-level integration where a QFP form factor is required.
• Commercial Grade & Temperature Range Rated for commercial operating temperatures from 0 °C to 85 °C, matching typical commercial electronics environments.
• RoHS Compliant Device is RoHS compliant, supporting lead-free and environmentally conscious assemblies.

Typical Applications

• Commercial Embedded Systems — Deploys programmable logic and on-chip memory to implement custom control, processing, and integration functions in commercial products.
• I/O-Intensive Designs — High I/O count (147 pins) supports designs that require multiple parallel interfaces or extensive sensor/actuator connectivity.
• Compact Board-Level Integration — QFP package and surface-mount mounting enable use in space-constrained commercial PCBs where a sizable FPGA resource set is needed.

Unique Advantages

• High Logic Density: 75,264 logic elements provide significant programmable capacity for complex logic and control functions, reducing the need for multiple discrete devices.
• Substantial On-Chip RAM: Approximately 0.5 Mbits of embedded memory enables efficient local buffering and small data-storage functions without external memory.
• Extensive I/O Resources: 147 user I/Os accommodate diverse interface requirements, simplifying board-level routing and integration.
• Low-Voltage Core Range: 1.14 V to 1.575 V operation aligns with lower-voltage core power domains to help manage overall power delivery.
• Compact, Surface-Mount QFP Package: The 208-BFQFP (28 × 28 mm) package balances packaging density with accessible pinout for medium-complexity board designs.
• Commercial Temperature Support & RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product lifecycles and environmentally conscious supply chains.

Why Choose A3PE3000L-1PQ208?

The A3PE3000L-1PQ208 positions itself as a commercial-grade FPGA solution for engineers needing a balance of high logic capacity, on-chip memory, and a large I/O set in a QFP package. Its combination of 75,264 logic elements, approximately 0.5 Mbits of embedded RAM, and 147 I/Os provides a versatile platform for consolidating discrete logic, implementing complex state machines, and handling multiple interfaces on a single device.

This device is appropriate for design teams targeting commercial embedded products that require scalable programmable logic, compact board integration, and compliance with RoHS requirements. Supplied by Microchip Technology, it offers a clear specification set for procurement and design planning in commercial electronics projects.

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