A3PE3000L-1PQG208I

The A3PE3000L-1PQG208I is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a reconfigurable logic fabric with a high count of logic elements and on-chip memory for implementing custom digital functions.

Designed for industrial applications, the device combines a large logic capacity, significant embedded memory, and a broad operating temperature range to support robust, board-level integration in surface-mount 208-pin BFQFP packaging.

Key Features

• Logic Capacity — 75,264 logic elements (cells) offering substantial resources for implementing complex digital designs.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering, state storage, and small lookup tables.
• Gate Equivalent — 3,000,000 gates of logic equivalent for sizing and architecture planning.
• I/O Resources — 147 general-purpose I/O pins to support multiple external interfaces and system connections.
• Power Requirements — Core voltage range from 1.14 V to 1.575 V, enabling integration with compatible power architectures.
• Industrial Temperature Range — Specified operating temperature from -40 °C to 100 °C for deployment in demanding environments.
• Packaging & Mounting — Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for compact PCB implementations.
• Regulatory Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control Systems — Use the industrial-grade temperature range and 147 I/Os to implement control logic, interface sensors, and manage field I/O on industrial equipment.
• Embedded Digital Logic — Leverage 75,264 logic elements and on-chip RAM to create custom processing blocks and glue logic in embedded devices.
• Interface Bridging and Custom I/O — Implement protocol conversion, parallel-to-serial interfaces, or bespoke I/O schemes using the device’s available I/O pins and reconfigurable fabric.
• Prototyping and Low-Volume Production — Surface-mount 208-BFQFP packaging and Microchip Technology manufacturing support board-level prototypes and production runs where FPGA reprogrammability is required.

Unique Advantages

• High Logic Density: 75,264 logic elements provide substantial on-chip resources to consolidate multiple functions into a single device, reducing external component count.
• Integrated On-Chip RAM: Approximately 0.516 Mbits of embedded memory supports local buffering and state storage without additional memory chips.
• Generous I/O Count: 147 I/Os allow flexible connection to peripherals and system buses, simplifying interface design.
• Industrial Robustness: Rated for -40 °C to 100 °C operation, suitable for deployment in industrial environments that require extended temperature tolerance.
• Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP footprint) enables dense PCB layouts while maintaining accessible pinout for complex designs.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and regulatory alignment.

Why Choose A3PE3000L-1PQG208I?

The A3PE3000L-1PQG208I delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a surface-mount 208-pin package from Microchip Technology. Its industrial operating range and RoHS compliance make it a practical choice for designers building reliable, long-lived systems that require reconfigurable logic.

This FPGA is well suited for development teams and procurement groups seeking a programmable solution with clear, verifiable specifications for logic density, memory, I/O count, power envelope, and temperature performance.

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