A3PE3000L-FG324
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 221 516096 324-BGA |
|---|---|
| Quantity | 1,739 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 221 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000L-FG324 – ProASIC3L FPGA, 324-BGA
The A3PE3000L-FG324 is a ProASIC3L Field Programmable Gate Array (FPGA) IC offering a high logic element count and integrated on-chip memory in a compact BGA package. It combines 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 221 user I/Os and roughly 3,000,000 gates to support complex programmable logic implementations.
Designed for surface-mount board integration, this commercial-grade device operates over a supply range of 1.14 V to 1.575 V and an operating temperature range of 0°C to 85°C, making it suitable for designs that require substantial programmable logic capacity in a 324-ball FBGA footprint.
Key Features
- Core and Logic Density 75,264 logic elements and approximately 3,000,000 gates to implement large-scale digital functions and custom logic.
- Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data paths.
- I/O Resources 221 user I/O pins provide extensive interfacing capacity for external peripherals and system signals.
- Power Operates from 1.14 V to 1.575 V, matching low-voltage core domain requirements.
- Package and Mounting 324-ball BGA package (supplier device package: 324-FBGA, 19×19) with surface-mount mounting for dense PCB layouts.
- Temperature and Grade Commercial-grade device rated for operation from 0°C to 85°C.
- Environmental RoHS-compliant construction.
Unique Advantages
- High integration in a compact footprint: A large logic element count and on-chip RAM in a 324-BGA package reduce the need for external components and save board space.
- Substantial I/O capacity: 221 user I/Os enable broad connectivity without additional multiplexing hardware.
- Low-voltage core compatibility: A 1.14 V to 1.575 V supply range aligns with modern low-voltage system designs.
- Commercial temperature rating: 0°C to 85°C operation suits a wide range of standard commercial applications.
- Regulatory-friendly design: RoHS compliance simplifies environmental and regulatory considerations for manufacturing.
Why Choose A3PE3000L-FG324?
The A3PE3000L-FG324 positions itself as a high-density programmable logic device that balances significant on-chip resources with a compact BGA footprint. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 221 I/Os makes it a practical choice for designers requiring extensive programmable logic capacity in surface-mount form factors.
As a commercial-grade, RoHS-compliant FPGA with a defined low-voltage supply range and standard operating temperature window, it provides a predictable hardware platform for projects that demand integration and scalability without introducing unspecified environmental or qualification claims.
Request a quote or submit a quote request for the A3PE3000L-FG324 to receive pricing and availability information tailored to your project needs.

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