A3PE3000L-FG324

IC FPGA 221 I/O 324FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 221 516096 324-BGA

Quantity 1,739 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O221Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000L-FG324 – ProASIC3L FPGA, 324-BGA

The A3PE3000L-FG324 is a ProASIC3L Field Programmable Gate Array (FPGA) IC offering a high logic element count and integrated on-chip memory in a compact BGA package. It combines 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 221 user I/Os and roughly 3,000,000 gates to support complex programmable logic implementations.

Designed for surface-mount board integration, this commercial-grade device operates over a supply range of 1.14 V to 1.575 V and an operating temperature range of 0°C to 85°C, making it suitable for designs that require substantial programmable logic capacity in a 324-ball FBGA footprint.

Key Features

  • Core and Logic Density 75,264 logic elements and approximately 3,000,000 gates to implement large-scale digital functions and custom logic.
  • Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data paths.
  • I/O Resources 221 user I/O pins provide extensive interfacing capacity for external peripherals and system signals.
  • Power Operates from 1.14 V to 1.575 V, matching low-voltage core domain requirements.
  • Package and Mounting 324-ball BGA package (supplier device package: 324-FBGA, 19×19) with surface-mount mounting for dense PCB layouts.
  • Temperature and Grade Commercial-grade device rated for operation from 0°C to 85°C.
  • Environmental RoHS-compliant construction.

Unique Advantages

  • High integration in a compact footprint: A large logic element count and on-chip RAM in a 324-BGA package reduce the need for external components and save board space.
  • Substantial I/O capacity: 221 user I/Os enable broad connectivity without additional multiplexing hardware.
  • Low-voltage core compatibility: A 1.14 V to 1.575 V supply range aligns with modern low-voltage system designs.
  • Commercial temperature rating: 0°C to 85°C operation suits a wide range of standard commercial applications.
  • Regulatory-friendly design: RoHS compliance simplifies environmental and regulatory considerations for manufacturing.

Why Choose A3PE3000L-FG324?

The A3PE3000L-FG324 positions itself as a high-density programmable logic device that balances significant on-chip resources with a compact BGA footprint. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 221 I/Os makes it a practical choice for designers requiring extensive programmable logic capacity in surface-mount form factors.

As a commercial-grade, RoHS-compliant FPGA with a defined low-voltage supply range and standard operating temperature window, it provides a predictable hardware platform for projects that demand integration and scalability without introducing unspecified environmental or qualification claims.

Request a quote or submit a quote request for the A3PE3000L-FG324 to receive pricing and availability information tailored to your project needs.

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