A3PE3000L-FG324I

The A3PE3000L-FG324I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It provides a balanced combination of logic density, on-chip memory, and a high I/O count in a compact 324-ball BGA package.

Typical use cases include industrial control and automation, communications and networking equipment, and embedded systems that require robust operation across an extended temperature range and a flexible supply voltage window.

Key Features

• Logic Capacity Approximately 75,264 logic elements delivering functional density for mid-range FPGA designs; equivalent to 3,000,000 gates as specified.
• Embedded Memory Approximately 0.52 Mbits of embedded RAM (516,096 total RAM bits) to support buffering, small data stores, and local processing.
• I/O Resources 221 I/O pins to support a wide range of external interfaces and peripherals.
• Power Supply Range Core voltage support from 1.14 V to 1.575 V, enabling design flexibility for power optimization.
• Package & Mounting 324-BGA (supplier device package 324-FBGA, 19×19) in a surface-mount format for compact board integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Automation High I/O count and industrial temperature rating make the device suitable for motor control, PLC interfaces, and sensor aggregation in factory environments.
• Communications Equipment Logic density and on-chip memory support packet handling, protocol bridging, and interface logic in networking and telecom modules.
• Embedded Systems Compact BGA packaging and mid-range logic capacity are suited for embedded control boards and custom I/O controllers.
• Test & Measurement The combination of numerous I/Os and embedded memory enables signal conditioning, data capture, and timing-critical instrumentation functions.

Unique Advantages

• High Logic Density: Approximately 75,264 logic elements (3,000,000 gates) provide substantial programmable logic capacity for complex mid-range designs.
• Integrated Memory Resources: Roughly 0.52 Mbits of on-chip RAM reduces reliance on external memory for many control and buffering tasks.
• Generous I/O Count: 221 I/Os enable flexible connectivity to sensors, transceivers, and peripherals without extensive external logic.
• Industrial Reliability: Specified operation from −40 °C to 100 °C and industrial grade designation support deployment in harsh environments.
• Compact, Surface-Mount BGA: 324-FBGA (19×19) package allows high-density board integration while maintaining signal routing efficiency.
• Power Flexibility: Core voltage range of 1.14 V to 1.575 V supports design choices for power and thermal budgets.

Why Choose A3PE3000L-FG324I?

The A3PE3000L-FG324I positions itself as a mid-range ProASIC3L FPGA offering a combination of logic capacity, embedded RAM, and a high number of I/Os in a compact industrial-grade BGA package. Its specified operating temperature range and RoHS compliance make it a practical choice for industrial and embedded system designs that require durable, board-level programmable logic.

Engineers designing control systems, communications interfaces, or embedded controllers will find this device appropriate when they need approximately 75k logic elements, significant on-chip RAM, and up to 221 external connections—all backed by Microchip Technology manufacturing.

Request a quote or submit a sales inquiry to check pricing and availability for the A3PE3000L-FG324I and to discuss how it fits your project requirements.