A3PE3000L-FG896

The A3PE3000L-FG896 is a ProASIC3L family Field Programmable Gate Array from Microchip Technology designed for applications that require high logic density, significant embedded memory, and a large number of I/O. This device integrates 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 620 user I/O in a compact 896-FBGA (31×31) package.

With a recommended supply range of 1.14 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, the A3PE3000L-FG896 targets commercial electronic designs needing programmable logic with high integration and a surface-mount BGA footprint.

Key Features

• Core Logic  75,264 logic elements (cells) and approximately 3,000,000 gates provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for implementing buffers, FIFOs, and state storage without external memory.
• I/O Density  620 user I/O pins support extensive external interfacing and parallel connectivity in I/O-intensive applications.
• Package and Mounting  896-BGA supplier device package (896-FBGA, 31×31) in a surface-mount format for compact board-level integration.
• Power  Core voltage supply range of 1.14 V to 1.575 V to match system power domains and enable low-voltage operation.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for standard commercial environments.
• Regulatory Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Systems  Implement custom logic, protocol engines, and peripheral controllers where high logic capacity and on-chip memory reduce external component needs.
• Communications Equipment  Use the abundant I/O and logic resources for protocol bridging, packet processing, and interface conversion in communications hardware.
• Consumer Electronics  Integrate display controllers, media interfaces, and custom user interfaces where a compact BGA footprint is advantageous.
• Prototyping and Development  Rapidly validate and iterate digital designs that require significant logic and memory resources before committing to fixed hardware.

Unique Advantages

• High Logic Density: 75,264 logic elements enable large-scale logic integration on a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and state storage without adding external memory chips.
• Extensive I/O Count: 620 I/O pins provide flexibility for multi-channel interfaces and parallel connectivity, simplifying system routing.
• Compact BGA Package: 896-FBGA (31×31) packaging delivers high pin-count in a small footprint, aiding compact board designs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial electronic products.
• RoHS Compliant: Environmentally compliant manufacturing supports standard production requirements.

Why Choose A3PE3000L-FG896?

The A3PE3000L-FG896 offers a balance of high logic capacity, on-chip memory, and extensive I/O in a compact 896-FBGA surface-mount package from Microchip Technology. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 620 I/O positions it for commercial designs that require significant programmable logic integration without a large external component count.

This device is suitable for engineers and procurement teams building complex FPGA-based solutions in consumer, communications, and embedded product lines where board space, I/O density, and integrated memory are important design considerations.

Request a quote or contact our sales team to discuss availability, pricing, and how the A3PE3000L-FG896 can meet your project requirements.