A3PE3000L-FG896M

The A3PE3000L-FG896M is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a high-pin-count 896-BGA package. It delivers substantial programmable logic capacity and I/O density for systems requiring MIL-STD-883 qualification and military-grade components.

With a large number of logic elements, significant on-chip memory, and an extended operating temperature range, this FPGA is intended for designs that demand durability, high I/O connectivity, and precise voltage operation.

Key Features

• Logic Capacity  75,264 logic elements and approximately 3,000,000 gates provide ample programmable resources for complex digital designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
• I/O Density  620 user I/O pins to accommodate high-connectivity applications and multi-interface designs.
• Package and Mounting  896-BGA (896‑FBGA, 31×31) package with surface-mount construction for compact, high-pin-count system integration.
• Power Supply  Narrow supply voltage range of 1.425 V to 1.575 V for defined, stable core operation.
• Temperature Range  Rated for operation from −55 °C to 125 °C to support deployment in demanding thermal environments.
• Qualification and Grade  Military grade with MIL-STD-883 qualification for applications that require rigorous component-level reliability testing.
• Regulatory Status  RoHS compliant.

Typical Applications

• Military and Defense Systems  Suitable for subsystems that require MIL-STD-883-qualified components and extended temperature operation.
• Rugged Embedded Electronics  High logic density and 620 I/Os support compact embedded controllers and signal-processing modules in harsh environments.
• High‑I/O Interface Hubs  Large I/O count enables aggregation and routing of multiple digital interfaces within a single FPGA footprint.

Unique Advantages

• High Logic Density: 75,264 logic elements and ~3,000,000 gates reduce the need for external glue logic and simplify system architecture.
• Substantial On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and control-state storage without external memory.
• Extensive I/O Capability: 620 I/O pins provide the connectivity required for multi-channel interfaces and complex board-level integration.
• Military Qualification: MIL-STD-883 qualification and military grade designation support procurement for defense and mission-critical programs.
• Wide Operating Temperature: −55 °C to 125 °C rating enables deployment in thermally challenging environments.
• Compact High-Pin‑Count Package: 896-BGA (31×31) delivers high interconnect density in a surface-mount form factor for space-constrained designs.

Why Choose A3PE3000L-FG896M?

The A3PE3000L-FG896M positions itself as a military-grade FPGA solution that combines large programmable logic capacity, significant on-chip memory, and a very high I/O count within an 896-BGA package. Its MIL-STD-883 qualification and extended temperature rating make it appropriate for designs that prioritize component-level reliability and environmental robustness.

Engineers specifying this device will find it suitable for complex, high-connectivity systems where logic density, deterministic supply requirements, and rugged operation are key decision factors. The part offers a balance of integration and durability for long-life or mission-critical product programs.

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