A3PE3000L-FGG324I

The A3PE3000L-FGG324I is a ProASIC3L field programmable gate array (FPGA) offered in a 324-BGA package for surface-mount applications. It combines a high logic capacity with embedded memory and a wide I/O complement to support complex, programmable digital designs.

Designed for industrial-grade deployments, this device operates from a low-voltage supply range and across an extended temperature window, making it suitable for applications that require robust, programmable logic in constrained board spaces.

Key Features

• Core / Logic  Approximately 75,264 logic elements and 3,000,000 gates provide substantial programmable logic capacity for complex implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM supports local buffering, state storage, and memory-intensive logic functions.
• I/O Count  221 user I/O pins enable broad connectivity for multiple interfaces and peripheral integration.
• Power / Supply  Operates from a 1.14 V to 1.575 V supply range, supporting low-voltage system designs.
• Package & Mounting  324-BGA (supplier device package: 324-FBGA, 19×19) in a surface-mount format for compact PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for extended-temperature environments.
• Environmental Compliance  RoHS compliant for reduced environmental impact in manufacturing and deployment.

Unique Advantages

• High logic density: The combination of ~75,264 logic elements and 3,000,000 gates enables implementation of complex control, processing, and glue-logic functions on a single device.
• On-chip memory: Approximately 0.516 Mbits of embedded RAM provides local storage for buffering and state machines without requiring external memory.
• Generous I/O provisioning: 221 I/O pins offer flexibility for interfacing with sensors, peripherals, and external logic.
• Low-voltage support: The 1.14 V to 1.575 V supply range aligns with modern low-voltage system architectures.
• Industrial temperature capability: Rated for -40 °C to 100 °C operation to support deployment in demanding environments.
• Compact BGA package: 324-FBGA (19×19) surface-mount package facilitates high-density PCB layouts.

Why Choose A3PE3000L-FGG324I?

The A3PE3000L-FGG324I positions itself as an industrial-grade FPGA option that balances high logic capacity, embedded memory, and extensive I/O within a compact BGA footprint. Its low-voltage operation and extended temperature range make it suitable for designs that require reliable programmable logic in constrained or challenging environments.

This device is appropriate for engineering teams and procurement groups seeking a single-chip programmable solution that offers scalability of logic and memory resources while maintaining compatibility with surface-mount, high-density PCB assembly processes.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information for the A3PE3000L-FGG324I.