A3PE3000L-FGG896

The A3PE3000L-FGG896 is a ProASIC3L field programmable gate array from Microchip Technology. It delivers a substantial programmable logic fabric with a high I/O count and on-chip memory, packaged in a compact 896-BGA footprint for surface-mount assembly.

Engineered for commercial embedded designs that require large logic capacity, abundant I/O, and low-voltage operation, this FPGA supports a range of applications where dense integration and configurable logic are priorities.

Key Features

• Logic Capacity — 75,264 logic elements (cells) providing a total of 3,000,000 gates for complex programmable logic implementations.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for data buffering, state storage, and control logic.
• High I/O Density — 620 user I/O pins to support extensive peripheral and system-level connectivity.
• Low-Voltage Core — Voltage supply range from 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting — 896-BGA package (supplier device package: 896-FBGA, 31 × 31) optimized for surface-mount PCB assembly and compact board layouts.
• Commercial Grade — Rated for an operating temperature range of 0 °C to 85 °C and specified as commercial grade.
• Regulatory — RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High‑density I/O systems — Use the 620 I/O pins to interface with multiple sensors, transceivers, and peripheral devices.
• Complex control and glue logic — Leverage the 75,264 logic elements and on-chip RAM for custom control paths and protocol bridging.
• Embedded system integration — Integrate programmable logic into compact, surface-mount designs using the 896-BGA package.

Unique Advantages

• Substantial programmable capacity: 75,264 logic elements and 3,000,000 gates enable sizable logic networks and moderate system consolidation.
• Significant on-chip memory: Approximately 0.52 Mbits of embedded RAM supports buffering and state storage without external memory.
• Extensive I/O availability: 620 I/Os provide flexibility for interfacing multiple peripherals and system buses.
• Compact, manufacturable package: 896-FBGA (31 × 31) supports high‑density PCB designs and surface-mount assembly processes.
• Low-voltage operation: 1.14 V to 1.575 V supply range aligns with modern low-voltage digital domains.
• Commercial readiness and RoHS compliance: Commercial temperature rating and RoHS compliance simplify integration into mainstream product lines.

Why Choose A3PE3000L-FGG896?

The A3PE3000L-FGG896 balances substantial logic resources, embedded memory, and a very high I/O count in a compact 896-BGA package, making it well-suited for commercial embedded designs that require programmable logic density and broad interfacing capability. Its low-voltage operation and surface-mount package support modern board design and power domains.

Backed by Microchip Technology, this ProASIC3L device is appropriate for teams seeking a commercially graded FPGA solution that consolidates control logic and I/O into a single, manufacturable component for medium- to high-complexity applications.

Request a quote or submit an inquiry to purchase the A3PE3000L-FGG896 and discuss availability and volume pricing with our sales team.