A3PE3000L-FGG896I

The A3PE3000L-FGG896I is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It combines high logic density and a large I/O count in a compact 896-BGA package for applications that require substantial on-chip logic and connectivity.

Designed for industrial environments, this device offers a broad core voltage range and an extended operating temperature span, making it suitable for I/O‑dense control, communications, and instrumentation systems where integration and reliability matter.

Key Features

• Logic Capacity 75,264 logic elements providing the equivalent of approximately 3,000,000 gates for implementing complex digital functions.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for buffering, state storage, and local data handling.
• I/O Density 620 user I/Os to support high channel counts, wide peripheral connectivity, and complex board-level interfaces.
• Low-Voltage Core Range Core supply range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting 896-BGA package (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for high-pin-count, space-efficient PCB designs.
• Industrial Temperature and Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in harsher environments.
• Environmental Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Leverages the industrial temperature range and extensive I/O count for motor control, PLC logic, and sensor interfacing in factory and process automation.
• Communications Equipment — Supports protocol bridging, signal handling, and custom packet processing where significant logic and I/O bandwidth are required.
• Test & Measurement — Useful for data acquisition front-ends, FPGA-based signal conditioning, and custom measurement logic that benefit from on-chip memory and dense I/O.
• High-density I/O Routing — Acts as a board-level I/O management and glue logic device in systems that require many parallel interfaces in a compact footprint.

Unique Advantages

• High integration density: 75,264 logic elements and roughly 3,000,000 gates let you consolidate multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 0.52 Mbits of embedded RAM enables local buffering and reduces reliance on external memory in many designs.
• Extensive I/O availability: 620 user I/Os provide flexibility for large numbers of sensors, peripherals, or parallel interfaces without additional multiplexing hardware.
• Compact, high-pin-count packaging: The 896-BGA (896-FBGA, 31×31) delivers the pin density required for complex systems while conserving PCB area.
• Industrial robustness: Rated for −40°C to 100°C operation and marked as industrial grade for deployment in demanding environments.
• Environmental compliance: RoHS compliance supports regulatory and sustainability requirements in manufacturing.

Why Choose A3PE3000L-FGG896I?

The A3PE3000L-FGG896I positions itself where high logic capacity, large I/O counts, and industrial-grade operation are required. Its combination of 75,264 logic elements, substantial on-chip RAM, and 620 I/Os in a compact 896-BGA package provides a balanced platform for integrating complex digital functions and rich connectivity on a single device.

This FPGA is suited to design teams building industrial control systems, communications modules, and measurement equipment that demand reliable operation across a wide temperature range, tight PCB real estate, and RoHS-compliant components. Its specifications support scalability and long-term use within systems that prioritize integration and connectivity.

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