A3PE3000L-PQ208I
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP |
|---|---|
| Quantity | 233 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000L-PQ208I – ProASIC3L Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP
The A3PE3000L-PQ208I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a 208-BFQFP package. It provides a dense logic fabric with a large on-chip memory complement and a substantial I/O count for industrial-grade programmable-logic applications.
With 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 147 user I/Os, this device targets industrial designs that require programmable logic capacity, moderate embedded RAM, and robust operating conditions.
Key Features
- Core Logic 75,264 logic elements (LEs) delivering the programmable logic resources required for complex custom logic and state-machine implementation.
- Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for local buffering, FIFOs and small data tables.
- Gate Count 3,000,000 gates to represent aggregate silicon capacity and integration density.
- I/O Density 147 user I/O pins supporting broad interfacing needs for sensors, actuators, and peripheral logic.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.575 V to match power-constrained environments.
- Package & Mounting Supplied in a 208-BFQFP package (supplier device package: 208-PQFP (28x28)) with surface-mount mounting for compact board designs.
- Industrial Temperature Range Rated for operation from -40°C to 100°C, suitable for industrial temperature environments.
- Environmental Compliance RoHS compliant for alignment with common environmental requirements.
Typical Applications
- Industrial control and automation Implement custom control logic and interface functions using the device’s 75,264 logic elements and 147 I/Os to connect to sensors, actuators and field devices.
- Protocol bridging and I/O aggregation Use the programmable fabric and high I/O count to consolidate multiple interfaces or translate between protocols within industrial equipment.
- Embedded logic and buffering Leverage approximately 0.52 Mbits of on-chip RAM for local buffering, queuing and small lookup-table storage in embedded systems.
Unique Advantages
- High integration of programmable logic: 75,264 logic elements and 3,000,000 gates allow substantial custom logic to be implemented on a single device, reducing BOM complexity.
- Meaningful on-chip memory: Approximately 0.52 Mbits of embedded RAM supports local data buffering and small data structures without needing external memory.
- Robust industrial operation: Rated from -40°C to 100°C and specified as industrial grade, enabling use in harsher temperature environments.
- Flexible I/O connectivity: 147 user I/Os provide the pin count needed for multi-channel interfacing and system integration.
- Compact surface-mount package: 208-BFQFP / 208-PQFP packaging supports dense board layouts while maintaining manufacturability.
- RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.
Why Choose A3PE3000L-PQ208I?
The A3PE3000L-PQ208I positions itself as a capable programmable-logic device for industrial designs that require a balance of logic capacity, on-chip memory and I/O density in a surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployments where environmental resilience matters.
Backed by Microchip Technology, this ProASIC3L device is well-suited for designers seeking a single-FPGA solution to consolidate custom logic, I/O interfacing and local memory needs while maintaining a compact board footprint and industrial operating range.
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