A3PE600-1FG256I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA |
|---|---|
| Quantity | 1,146 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 165 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of A3PE600-1FG256I – ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA
The A3PE600-1FG256I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It provides a balance of programmable logic, on-chip memory and I/O capacity to implement custom digital functions in compact, surface-mount 256-LBGA packaging.
With 13,824 logic elements (CLBs), approximately 0.11 Mbits of embedded memory, 165 user I/Os and an operating range tailored for industrial environments, this device is suited for designs that require moderate gate density, flexible I/O and robust operating temperature support.
Key Features
- Logic Capacity — 13,824 logic elements (CLBs) providing the fabric to implement up to 600,000 gates for mid-scale digital designs.
- On-chip Memory — Approximately 0.11 Mbits of embedded RAM (110,592 bits) to support buffering, small FIFOs and local storage for logic blocks.
- I/O Count — 165 user I/Os to accommodate broad peripheral interfacing and board-level connectivity requirements.
- Power Supply — Core voltage supply specified at 1.425 V to 1.575 V to match system power rails and ensure predictable device operation.
- Package & Mounting — 256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, making it suitable for industrial environments.
- Mounting Type — Surface mount construction supports standard assembly processes for modern electronics manufacturing.
- RoHS Compliant — Conforms to RoHS requirements for environmental compliance.
Typical Applications
- Industrial Control — Implement custom control logic, I/O aggregation and sequencing functions for industrial automation equipment within an industrial temperature envelope.
- Embedded Systems — Provide glue logic, protocol bridging and feature acceleration in compact embedded controller designs that require moderate gate density and on-chip memory.
- Interface and I/O Expansion — Use the 165 user I/Os to create flexible interface hubs, signal conditioning logic or custom peripheral interfaces on constrained PCBs.
- Prototyping and Mid-Scale FPGA Designs — Deploy as a development or production FPGA for projects needing up to 600,000 gates and thousands of logic elements in a small BGA package.
Unique Advantages
- Balanced Logic and Memory: 13,824 logic elements combined with embedded RAM provide a practical mix of resources for control and data-path tasks without overprovisioning.
- Substantial I/O Density: 165 user I/Os enable direct connection to a wide range of peripherals and sensors, reducing the need for external multiplexers or expanders.
- Industrial Reliability: Rated operation from −40 °C to 100 °C and industrial grade designation support deployment in demanding environmental conditions.
- Compact Surface-Mount Package: 256-LBGA (17×17) allows high integration on space-constrained PCBs while supporting standard SMT assembly.
- Predictable Power Requirements: Defined core voltage range of 1.425 V to 1.575 V simplifies power supply design and validation.
- RoHS Compliance: Environmentally compliant manufacturing support for regulated markets.
Why Choose A3PE600-1FG256I?
The A3PE600-1FG256I positions itself as a dependable mid-capacity FPGA option for engineers building industrial and embedded systems that require a solid balance of logic resources, I/O count and on-chip memory. Its 13,824 logic elements and 600,000-gate equivalence provide the programmability needed for control, interfacing and moderate data-path functions while the 165 I/Os help minimize external components.
With industrial temperature ratings, a compact 256-LBGA package and clearly defined power requirements, this device offers a practical combination of integration and robustness for production designs that must operate reliably across a wide temperature range.
Request a quote or submit an inquiry to receive pricing and availability information for the A3PE600-1FG256I. Our team can provide lead-time details and help evaluate this FPGA for your design requirements.

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