A3PE600-1FG256I

IC FPGA 165 I/O 256FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA

Quantity 1,146 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O165Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of A3PE600-1FG256I – ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA

The A3PE600-1FG256I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It provides a balance of programmable logic, on-chip memory and I/O capacity to implement custom digital functions in compact, surface-mount 256-LBGA packaging.

With 13,824 logic elements (CLBs), approximately 0.11 Mbits of embedded memory, 165 user I/Os and an operating range tailored for industrial environments, this device is suited for designs that require moderate gate density, flexible I/O and robust operating temperature support.

Key Features

  • Logic Capacity — 13,824 logic elements (CLBs) providing the fabric to implement up to 600,000 gates for mid-scale digital designs.
  • On-chip Memory — Approximately 0.11 Mbits of embedded RAM (110,592 bits) to support buffering, small FIFOs and local storage for logic blocks.
  • I/O Count — 165 user I/Os to accommodate broad peripheral interfacing and board-level connectivity requirements.
  • Power Supply — Core voltage supply specified at 1.425 V to 1.575 V to match system power rails and ensure predictable device operation.
  • Package & Mounting — 256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, making it suitable for industrial environments.
  • Mounting Type — Surface mount construction supports standard assembly processes for modern electronics manufacturing.
  • RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Industrial Control — Implement custom control logic, I/O aggregation and sequencing functions for industrial automation equipment within an industrial temperature envelope.
  • Embedded Systems — Provide glue logic, protocol bridging and feature acceleration in compact embedded controller designs that require moderate gate density and on-chip memory.
  • Interface and I/O Expansion — Use the 165 user I/Os to create flexible interface hubs, signal conditioning logic or custom peripheral interfaces on constrained PCBs.
  • Prototyping and Mid-Scale FPGA Designs — Deploy as a development or production FPGA for projects needing up to 600,000 gates and thousands of logic elements in a small BGA package.

Unique Advantages

  • Balanced Logic and Memory: 13,824 logic elements combined with embedded RAM provide a practical mix of resources for control and data-path tasks without overprovisioning.
  • Substantial I/O Density: 165 user I/Os enable direct connection to a wide range of peripherals and sensors, reducing the need for external multiplexers or expanders.
  • Industrial Reliability: Rated operation from −40 °C to 100 °C and industrial grade designation support deployment in demanding environmental conditions.
  • Compact Surface-Mount Package: 256-LBGA (17×17) allows high integration on space-constrained PCBs while supporting standard SMT assembly.
  • Predictable Power Requirements: Defined core voltage range of 1.425 V to 1.575 V simplifies power supply design and validation.
  • RoHS Compliance: Environmentally compliant manufacturing support for regulated markets.

Why Choose A3PE600-1FG256I?

The A3PE600-1FG256I positions itself as a dependable mid-capacity FPGA option for engineers building industrial and embedded systems that require a solid balance of logic resources, I/O count and on-chip memory. Its 13,824 logic elements and 600,000-gate equivalence provide the programmability needed for control, interfacing and moderate data-path functions while the 165 I/Os help minimize external components.

With industrial temperature ratings, a compact 256-LBGA package and clearly defined power requirements, this device offers a practical combination of integration and robustness for production designs that must operate reliably across a wide temperature range.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE600-1FG256I. Our team can provide lead-time details and help evaluate this FPGA for your design requirements.

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