A3PE600-1FGG256

The A3PE600-1FGG256 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of programmable logic, on-chip memory, and I/O capacity in a compact 256-LBGA surface-mount package.

This device is suited for designs that require up to 13,824 logic elements (approximately 600,000 gates), 165 dedicated I/O signals, and approximately 0.11 Mbits of embedded memory, with operation across a commercial temperature range and a defined core supply window.

Key Features

• Core Logic  13,824 logic elements providing logical capacity equivalent to 600,000 gates for implementing complex digital functions.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM available for buffering, state storage, and small data structures.
• I/O Resources  165 I/O pins to support multiple peripheral interfaces and high-pin-count system connections.
• Power  Operates from a defined core voltage range of 1.425 V to 1.575 V to match system power domains.
• Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common environmental requirements.

Typical Applications

• Custom digital logic  Implement state machines, protocol handling, and glue logic using up to 13,824 logic elements and integrated memory.
• I/O-intensive interfacing  Bridge multiple peripherals or sensor banks with 165 available I/O pins for flexible system connectivity.
• Embedded control functions  Deploy control and timing functions within systems that operate inside a 0 °C to 85 °C commercial temperature range.

Unique Advantages

• High logic density: 13,824 logic elements provide substantial programmable capacity for mid-range FPGA designs.
• Integrated memory: Approximately 0.11 Mbits of on-chip RAM reduces the need for external memory for small buffers and state storage.
• Generous I/O count: 165 I/O pins enable broad peripheral interfacing without additional I/O expanders.
• Compact, manufacturable package: 256-LBGA surface-mount package supports dense PCB layouts and automated assembly.
• Defined power envelope: Narrow supply range (1.425 V–1.575 V) simplifies power-supply design for the FPGA core.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose A3PE600-1FGG256?

The A3PE600-1FGG256 positions itself as a mid-range ProASIC3E FPGA option from Microchip Technology, offering a mix of logic capacity, embedded memory, and I/O resources in a compact 256-LBGA package. Its specification set fits designs that require significant programmable logic and I/O density while operating within a commercial temperature range.

This device is appropriate for engineering teams and procurement looking for a Microchip-sourced FPGA with clearly defined electrical and mechanical parameters, RoHS compliance, and surface-mount packaging compatible with automated PCB assembly.

Request a quote or submit an inquiry to discuss availability, pricing, and delivery for the A3PE600-1FGG256.