A3PE600-1FGG484

The A3PE600-1FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a balance of programmable logic capacity, embedded memory, and high I/O count in a compact 484-BGA package for commercial electronic designs.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 270 user I/O pins, making the device suitable for a range of commercial embedded and digital designs that require moderate logic density and substantial I/O integration.

Key Features

• Core Logic — 13,824 logic elements (cells) and a gate count of 600,000 provide the programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory — Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits, for buffering, FIFOs, and on-chip storage of intermediate data.
• I/O Capacity — 270 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level interconnect requirements.
• Package and Mounting — 484-BGA package in a 484-FPBGA (23×23) footprint with surface-mount mounting type for compact, high-density board designs.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power-rail requirements.
• Operating Range — Commercial-grade operation from 0°C to 85°C for use in standard commercial environments.
• Regulatory — RoHS compliant to meet standard environmental requirements for commercial electronics.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and interface glue in applications that require up to 13,824 logic elements and a high I/O count.
• Digital I/O Expansion — Use the 270 I/Os to consolidate multiple peripheral interfaces or to bridge parallel buses in board-level designs.
• On-Board Data Buffering — Leverage approximately 0.11 Mbits of embedded memory for small buffering, FIFOs, and temporary data storage within control and signal-processing flows.

Unique Advantages

• High Logic Density in a Compact Package: 13,824 logic elements and 600,000 gates packaged in a 484-BGA (23×23) footprint enable significant functionality without large PCB area impact.
• Extensive I/O Availability: 270 user I/Os reduce the need for external I/O expanders and simplify routing for multi-channel or multi-peripheral designs.
• On-Chip Memory for Local Data Handling: Approximately 0.11 Mbits of embedded RAM supports buffering and local storage to improve data-path efficiency.
• Commercial Temperature and RoHS Compliance: Rated 0°C to 85°C and RoHS compliant to meet common commercial product requirements.
• Low-Voltage Core Operation: Narrow supply range (1.425 V–1.575 V) enables predictable core power behavior within defined system rails.
• Surface-Mount BGA Convenience: 484-FPBGA mounting simplifies assembly and supports high-density PCB design practices.

Why Choose A3PE600-1FGG484?

The A3PE600-1FGG484 is positioned for commercial designs that require moderate to high logic capacity, substantial I/O capability, and on-chip memory in a compact BGA package. Its combination of 13,824 logic elements, 270 I/Os, and embedded RAM makes it well suited for embedded and board-level digital implementations where integration and predictable power/temperature behavior matter.

Manufactured by Microchip Technology and supplied in a surface-mount 484-FPBGA (23×23) package, this device offers a reliable building block for developers seeking a programmable logic solution for commercial electronic products.

Request a quote or submit an inquiry to get pricing and availability for the A3PE600-1FGG484. Our team can provide ordering information and support for incorporating this FPGA into your next design.