A3PE600-2FG256I

The A3PE600-2FG256I is a ProASIC3E flash-based field programmable gate array from Microchip Technology. It delivers 13,824 logic elements and approximately 0.11 Mbits of embedded memory in a surface-mount 256‑LBGA package.

Designed for industrial-temperature applications, this device supports a 1.425 V to 1.575 V supply range, provides 165 user I/O pins, and is RoHS compliant—suiting designs that require reprogrammable logic, moderate on-chip memory, and reliable operation across a wide temperature range.

Key Features

• Core Logic  13,824 logic elements (logic cells) providing a flexible fabric for custom logic implementations.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffering, state storage, and small data structures.
• User I/O  165 user I/O pins to interface with external peripherals, sensors, and other system components.
• Gate Capacity  Approximately 600,000 gates to describe overall device complexity and mapping scope.
• Power  Operates from a supply range of 1.425 V to 1.575 V to match target system power rails.
• Package and Mounting  256‑LBGA (supplier package: 256‑FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for extended environmental tolerance.
• Compliance  RoHS compliant to support lead‑free assembly and regulatory requirements.

Typical Applications

• Embedded Control  Implements custom control logic and state machines where reprogrammability and moderate logic density are required.
• Interface Bridging  Provides configurable I/O and glue logic to bridge between digital peripherals and system buses.
• Signal Processing  Hosts small-scale, latency-sensitive processing functions that benefit from on-chip RAM and programmable logic.

Unique Advantages

• Industrial Temperature Capability: Operational range from −40 °C to 100 °C supports deployment in demanding environments.
• High Logic Integration: 13,824 logic elements and ~600,000 gates allow implementation of substantial custom logic without external CPLDs or discrete glue.
• Compact Package: 256‑LBGA (17×17 FPBGA) simplifies board layout and preserves PCB real estate for space-constrained designs.
• Flexible I/O Count: 165 user I/O pins enable multiple peripheral connections and configurable interfaces directly on-chip.
• Controlled Supply Range: Narrow 1.425 V–1.575 V supply window supports stable power design and predictable device behavior.
• RoHS Compliant: Facilitates lead‑free assembly and helps meet regulatory directives for restricted substances.

Why Choose A3PE600-2FG256I?

The A3PE600-2FG256I positions itself as a capable, industrial-grade FPGA option for engineers who need a balance of logic density, on-chip memory, and flexible I/O in a compact, surface-mount package. Its defined supply range and extended temperature rating make it suitable for long-lived designs that demand consistent behavior across environmental extremes.

This device is well suited to development teams implementing embedded control, interface bridging, or modest signal-processing functions that benefit from field programmability, integrated memory, and a dense pinout—delivering a practical combination of integration and reliability backed by Microchip Technology.

Request a quote or submit a product inquiry to evaluate the A3PE600-2FG256I for your design and obtain pricing, availability, and technical support information.