A3PE600-2FG484

The A3PE600-2FG484 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements (cells), approximately 0.11 Mbits of embedded RAM, and up to 270 I/O pins in a 484-ball BGA package for compact, reconfigurable digital designs.

This device targets commercial-grade applications requiring moderate logic capacity, substantial I/O connectivity and a compact surface-mount package, while operating within a 1.425 V to 1.575 V supply range and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  13,824 logic elements (cells) and an indicated 600,000 gates provide the programmable fabric needed for medium-density logic integration.
• On‑Chip Memory  Total embedded RAM of 110,592 bits (approximately 0.11 Mbits) for internal buffering, state storage and small lookup tables.
• I/O Capacity  Up to 270 general-purpose I/O pins to support a wide range of external interfaces and peripherals.
• Package & Mounting  Available in a 484-BGA package (supplier package: 484-FPBGA, 23×23) with surface-mount mounting for dense PCB layouts.
• Power  Specified operating voltage range of 1.425 V to 1.575 V to match system power domains within that range.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support standard lead-free assembly processes.

Typical Applications

• I/O‑intensive designs  Systems that require up to 270 I/O signals for interfacing with multiple peripherals or external logic.
• Embedded logic and buffering  Designs that leverage approximately 0.11 Mbits of on‑chip RAM for internal data storage and small buffering tasks.
• Compact, surface‑mount assemblies  Board-level products that benefit from the 484-BGA (484-FPBGA, 23×23) package and surface-mount mounting in commercial environments.

Unique Advantages

• High logic capacity: 13,824 logic elements and 600,000 gates enable substantial programmable functionality within a single device.
• Balanced memory and logic: Approximately 0.11 Mbits of embedded RAM combined with the logic fabric supports localized data handling and state machines.
• Significant I/O availability: 270 I/O pins offer flexibility for dense external interfacing without external GPIO expanders.
• Compact BGA package: The 484-FPBGA (23×23) footprint provides a high pin count in a package suited for space-constrained PCBs.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial production environments.
• Low-voltage operation: Narrow supply window of 1.425 V to 1.575 V simplifies power-domain planning for systems operating in that range.

Why Choose A3PE600-2FG484?

The A3PE600-2FG484 from Microchip Technology delivers a balanced combination of logic density, embedded memory and high I/O count in a compact 484-BGA surface-mount package. Its specifications make it suitable for commercial designs that require medium-density programmable logic, on‑chip RAM and substantial external connectivity while operating within standard commercial temperature and low-voltage supply ranges.

This device is an option for engineering teams looking to consolidate logic, buffering and I/O on a single FPGA device to reduce board-level component count and simplify system architecture.

Request a quote or submit a sales inquiry to obtain pricing and availability for the A3PE600-2FG484.