A3PE600-2FGG256

The A3PE600-2FGG256 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a balanced combination of logic density, I/O count and embedded memory for commercial-grade designs. With 13,824 logic elements, 165 I/O pins and approximately 0.108 Mbits of on-chip RAM, it is suited to applications that require moderate programmable logic capacity in a compact surface-mount package.

Key Features

• Logic Capacity  13,824 logic elements (logic cells) and 600,000 gates provide a measurable foundation for moderate-complexity logic integration and custom peripheral implementation.
• Embedded Memory  Approximately 0.108 Mbits of total on-chip RAM to support buffering, small data tables and state storage within the FPGA fabric.
• I/O Count  165 general-purpose I/O pins deliver flexible external interfacing for multiple peripherals and bus connections.
• Package & Mounting  Supplied in a 256-FPBGA (17×17) package and intended for surface-mount assembly; packaged as tray for volume handling.
• Power  Specified single supply voltage of 1.425 V for core operation, enabling predictable power budgeting in system design.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation and specified as commercial grade for typical consumer and equipment environments.

Typical Applications

• Consumer Electronics  Integration of custom logic, display and interface control functions where moderate logic density and a compact BGA footprint are required.
• Communications Equipment  Protocol handling, multiplexing and interface bridging using the device’s available I/O and on-chip logic resources.
• Test & Measurement  Custom timing, data capture and signal routing implementations that benefit from on-chip RAM and plentiful I/O.
• Embedded Systems & Prototyping  Platform for developing and validating custom peripherals and system glue logic in commercial electronic products.

Unique Advantages

• Moderate Logic Density: 13,824 logic elements and 600,000 gates enable consolidation of multiple discrete functions into a single programmable device, reducing board complexity.
• Generous I/O Count: 165 I/O pins provide flexibility for connecting multiple sensors, buses and external devices without extensive external multiplexing.
• Compact BGA Packaging: 256-FPBGA (17×17) footprint offers a space-efficient solution for board designs that require a high pin-count in a small area.
• Predictable Power Rail: Single 1.425 V core supply simplifies power-rail planning and helps control core power design.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet the environmental expectations of commercial-grade electronics.
• Tray Packaging for Volume Handling: Supplied in tray format to support streamlined assembly and manufacturing processes.

Why Choose A3PE600-2FGG256?

The A3PE600-2FGG256 positions itself as a practical FPGA choice for designers needing a commercial-grade programmable device with measurable logic capacity, ample I/O and on-chip RAM in a compact BGA package. Its combination of 13,824 logic elements, 165 I/O and approximately 0.108 Mbits of embedded memory provides a solid platform for integrating custom logic, protocol handling and interface functions.

Backed by Microchip Technology, this device is suitable for teams and projects seeking a reliable, commercially rated FPGA for consumer, communications, test/evaluation and embedded system applications where moderate logic density and a predictable power and thermal profile are required.

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