A3PE600-FG256

The A3PE600-FG256 is a ProASIC3E family Field Programmable Gate Array (FPGA) IC. It integrates 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 165 user I/O in a compact 256-LBGA package for commercial applications.

Designed for commercial-grade embedded and general-purpose programmable logic use, the device balances logic capacity, embedded memory, and I/O density while operating from a 1.425 V to 1.575 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 13,824 logic elements (cells) with an architecture targeted for configurable digital logic integration.
• Embedded Memory 110,592 bits of on-chip RAM—approximately 0.11 Mbits—providing local storage for buffering and state data.
• I/O Capability 165 user I/O pins to support multiple external interfaces and peripheral connections.
• Gate Density Equivalent to 600,000 gates, enabling moderately complex logic implementations within a single device.
• Power Supply Single supply operation between 1.425 V and 1.575 V for the core domain.
• Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount construction for compact board integration.
• Commercial Temperature Grade Specified for 0 °C to 85 °C operation for commercial-environment deployments.
• RoHS Compliant Meets RoHS requirements for lead-free assembly and regulatory compatibility.

Typical Applications

• Commercial Embedded Systems — Implements custom logic, glue-logic, and control functions in commercial electronics designs.
• Communications and Networking Equipment — Provides on-chip logic and I/O density suitable for protocol handling and interface adaptation in commercial networking gear.
• Test and Measurement — Enables configurable signal processing and timing logic for bench and production test equipment in commercial settings.
• Consumer and Pro AV Devices — Supports custom control, interface bridging, and feature integration where commercial-grade FPGAs are required.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements combined with approximately 0.11 Mbits of RAM support mid-range logic functions with local data storage.
• Generous I/O Count: 165 user I/Os allow flexible connections to external peripherals and multiple interface types without external multiplexing.
• Compact High-Density Package: 256-LBGA (256-FPBGA, 17×17) delivers high pin density in a small footprint for space-constrained PCBs.
• Single-Supply Core Voltage: Operates within a defined 1.425 V–1.575 V range, simplifying power-rail planning for the core domain.
• Commercial Temperature Rating: Specified 0 °C–85 °C operation suited to commercial deployment environments.
• RoHS Compliance: Facilitates lead-free assembly and helps meet environmental regulatory requirements.

Why Choose A3PE600-FG256?

The A3PE600-FG256 delivers a practical combination of logic density, embedded RAM, and I/O capacity in a compact 256-LBGA package, tailored for commercial embedded and general-purpose programmable logic designs. Its defined voltage and temperature specifications make system-level integration and qualification straightforward for commercial applications.

This device is well suited to designers seeking a field-programmable solution that balances on-chip resources and package density while meeting RoHS requirements and commercial temperature limits.

If you require pricing, availability, or a formal quote for the A3PE600-FG256, submit a quote request or contact sales to receive a customized quotation and lead-time information.