A3PE600-FG484

The A3PE600-FG484 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It provides a mid-density programmable logic resource with 13,824 logic elements and up to 600,000 gates in a 484-FPBGA (23×23) surface-mount package.

With 270 I/O pins, approximately 0.108 Mbits of on-chip RAM and a fixed 1.425 V supply requirement, this commercial-grade FPGA supports designs that need moderate logic capacity, significant I/O count and on-chip memory within a compact BGA footprint, operating across a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  13,824 logic elements delivering up to 600,000 gates for medium-density programmable logic implementations.
• Embedded Memory  Approximately 0.108 Mbits of on-chip RAM (108,000 bits) to support data buffering, FIFOs and small memory structures without external SRAM.
• I/O Resources  270 general-purpose I/O pins provide extensive connectivity for interfacing to peripherals, sensors and external logic.
• Power  Single supply voltage specified at 1.425 V for core operation, simplifying power-supply design for the FPGA core.
• Package & Mounting  484-FPBGA (23×23) supplier device package in a surface-mount form factor; supplied in tray packaging.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Manufacturer  Produced by Microchip Technology as part of the ProASIC3E family.

Typical Applications

• Custom Logic and Control  Used where designs require up to 600,000 gates and substantial I/O count for implementing custom state machines, glue logic and control functions.
• Interface Concentration  Suitable for applications that need to aggregate and route multiple signals thanks to 270 available I/Os and embedded RAM for short-term buffering.
• Embedded Processing Support  Can host soft-logic functions and peripheral interfaces that leverage the FPGA’s logic elements and on-chip memory.

Unique Advantages

• Balanced Logic and I/O  Combines 13,824 logic elements with 270 I/Os to address designs that need both moderate internal logic and extensive external connectivity.
• On-chip Memory Availability  Approximately 0.108 Mbits of embedded RAM reduces reliance on external memory for small data buffers and FIFOs.
• Compact BGA Footprint  484-FPBGA (23×23) package allows high-density board integration in a surface-mount form factor.
• Simplified Power Requirement  A defined core supply of 1.425 V streamlines power-supply selection for the FPGA core.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to meet standard commercial-environment deployment requirements.

Why Choose A3PE600-FG484?

The A3PE600-FG484 positions itself as a versatile ProASIC3E FPGA option for projects that require a mix of medium-density logic, significant I/O capacity and on-chip memory in a compact BGA package. Its defined electrical and thermal specifications make it straightforward to integrate into commercial designs that must balance board space, connectivity and programmable logic resources.

Backed by Microchip Technology manufacturing, this FPGA is aimed at engineers and procurement professionals seeking predictable, verifiable device characteristics—13,824 logic elements, 270 I/Os, approximately 0.108 Mbits of embedded RAM, and a 1.425 V core supply—delivered in a 484-FPBGA (23×23) surface-mount package.

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