A3PE600-2FGG484I

The A3PE600-2FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology, provided in a 484-ball fine-pitch BGA package. It delivers a combination of programmable logic, embedded RAM and extensive I/O capability suitable for designs that require up to 600,000 gates and 13,824 logic elements.

With a supply voltage range of 1.425 V to 1.575 V and an industrial operating temperature range from -40 °C to 100 °C, this device targets systems that need substantial on-chip logic and memory capacity together with broad I/O in a compact surface-mount package.

Key Features

• Core Logic Approximately 600,000 gates realized through 13,824 logic elements to implement custom digital functions and complex state machines.
• Embedded Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for local buffering, scratch memory, and small lookup tables.
• I/O Capacity 270 user I/O pins to support extensive peripheral interfacing and multiple external signal connections.
• Power Operates from a nominal supply range of 1.425 V to 1.575 V for core power delivery.
• Package and Mounting 484-ball FPBGA (23 × 23 mm) package in a surface-mount configuration for compact board-level integration.
• Temperature and Grade Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for elevated-environment applications.
• Regulatory Compliance RoHS-compliant construction for alignment with environmental requirements.

Typical Applications

• I/O-intensive control systems — Use the 270 I/O pins to interface with multiple sensors, peripherals, and external logic in industrial control or instrumentation designs.
• Custom digital processing — Implement application-specific data paths and state machines using the 13,824 logic elements and 600,000-gate capacity.
• On-chip buffering and lookup tables — Leverage approximately 0.11 Mbits of embedded RAM for local data storage, FIFOs, or small LUTs to accelerate deterministic processing.

Unique Advantages

• High logic density: 600,000 gates and 13,824 logic elements provide substantial programmable resources for complex designs without external FPGA fabric.
• Large I/O count: 270 I/O pins enable broad peripheral connectivity and flexible board-level interfacing options.
• Compact BGA package: 484-ball FPBGA (23 × 23 mm) allows high-density mounting while keeping PCB footprint compact.
• Industrial temperature rating: -40 °C to 100 °C operation supports deployments in demanding thermal environments.
• Low-voltage core operation: Narrow supply range (1.425 V to 1.575 V) supports stable core power design and predictable performance.
• RoHS compliant: Environmentally compliant manufacturing aligns with common regulatory requirements.

Why Choose A3PE600-2FGG484I?

The A3PE600-2FGG484I balances substantial programmable logic capacity, embedded memory, and a high pin count in a compact 484-BGA package, making it suitable for engineering teams who need robust on-chip resources and extensive I/O in industrial-temperature applications. Its specifications enable integration of custom digital functions and local memory without excessive external components.

Choose this device for designs that require a combination of logic density, I/O flexibility, and board-level compactness, backed by Microchip Technology manufacturing and RoHS-compliant construction.

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