A3PE600-FG484I

The A3PE600-FG484I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology, offering a balance of logic density, I/O count and on-chip memory for industrial designs. With 600,000 gates, 13,824 logic elements and 270 I/O pins in a 484-ball BGA package, it is suited for applications that require configurable digital logic within an industrial temperature range.

Key value comes from its combination of mid-range logic capacity, on-chip RAM, and a compact 484-FPBGA (23×23) surface-mount package, enabling integration in space-constrained, temperature-demanding systems.

Key Features

• Logic Capacity  13,824 logic elements providing up to 600,000 gates for implementing medium-complexity digital designs.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support buffers, FIFOs and local data storage without external memory.
• I/O Density  270 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the FPGA fabric.
• Power  Specified core voltage range of 1.425 V to 1.575 V to match system power rails and ensure predictable power behavior.
• Package & Mounting  484-ball FPBGA (23×23) package designed for surface-mount PCB assembly, offering a compact footprint for board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet elevated and extended-temperature deployment requirements.
• Regulatory Status  RoHS compliant.

Unique Advantages

• Substantial Logic and Gate Count: 13,824 logic elements and 600,000 gates provide the capacity to implement complex state machines, datapaths and custom accelerators without external ASICs.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for local buffering and control functions, simplifying BOM and board routing.
• High I/O Availability: 270 I/Os enable direct interfacing to a wide range of peripherals and sensors, reducing the need for additional interface devices.
• Industrial Robustness: Operation from −40 °C to 100 °C and a surface-mount BGA package make the device suitable for temperature-challenging and space-constrained designs.
• Compact Package: The 484-FPBGA (23×23) footprint facilitates high-density PCB layouts while supporting ample I/O and signal routing.
• Environmental Compliance: RoHS compliance supports regulatory and sustainability requirements for electronic assemblies.

Why Choose A3PE600-FG484I?

The A3PE600-FG484I delivers a practical combination of logic resources, embedded memory and a high I/O count in an industrial-grade FPGA package. Its specifications align with projects that require reliable operation across extended temperatures and a compact board footprint, while minimizing external component count.

This part is well suited to engineering teams and procurement organizations targeting mid-density programmable logic solutions that demand predictable power behavior, substantial on-chip resources, and RoHS-compliant components backed by a recognized semiconductor manufacturer.

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