A3PE600-FGG484

The A3PE600-FGG484 is a ProASIC3E FPGA IC from Microchip Technology designed for commercial embedded logic applications. It provides a balance of programmable logic capacity, on-chip memory, and I/O density in a 484-ball FPBGA package for surface-mount assembly.

With 13,824 logic elements, approximately 0.108 Mbits of embedded memory, and 270 I/O pins, this device targets designs that require moderate gate count and flexible I/O while operating from a fixed 1.425 V supply across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 13,824 logic elements providing the programmable logic resources needed for medium-complexity designs.
• Gate Count — 600,000 gates enabling implementation of sizable logic functions and state machines.
• Embedded Memory — Approximately 0.108 Mbits of on-chip RAM for buffering, small data storage, and temporary tables.
• I/O Resources — 270 user I/O pins to support multiple external interfaces and parallel connections.
• Power — Single supply operation at 1.425 V simplifying power-rail planning for the core.
• Package and Mounting — 484-FPBGA (23 × 23 mm) supplier package in a tray format; surface-mount for standard PCB assembly.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for typical commercial environments.

Typical Applications

• Commercial Embedded Systems — Use where 13,824 logic elements and 270 I/O pins are required to implement configurable logic and I/O routing in commercial devices.
• Control and Interface Logic — Suitable for designs that need 600,000 gates and embedded memory to implement control/state machines and buffering for peripheral interfaces.
• Prototyping and Development — Fits prototyping scenarios requiring medium-density FPGAs in a standard 484-FPBGA package for surface-mount boards.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates deliver sufficient capacity for medium-complexity FPGA tasks without over-provisioning.
• Compact, High I/O Count: 270 I/O pins in a 23 × 23 mm FPBGA enable dense signal routing and multiple peripheral connections while keeping board footprint modest.
• On-chip Memory: Approximately 0.108 Mbits of embedded RAM reduces dependence on external memory for small buffers and lookup tables.
• Simplified Power Planning: Single specified core supply of 1.425 V eases power-rail design for the FPGA core.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial application environments.
• Surface-Mount Package: 484-FPBGA tray format supports standard surface-mount assembly processes for volume manufacturing.

Why Choose A3PE600-FGG484?

The A3PE600-FGG484 positions itself as a practical choice for commercial designs that require a moderate amount of programmable logic, substantial I/O, and on-chip memory in a compact BGA footprint. Its combination of 13,824 logic elements, 600,000 gates, and 270 I/O pins provides designers the flexibility to implement control logic, interface glue, and medium-complexity algorithms without resorting to larger, higher-cost devices.

This device is suited for development teams and product designs that prioritize integration and predictable operating conditions across the commercial temperature range, while maintaining a compact board footprint and surface-mount assembly compatibility.

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