A3PE600L-1FGG484M
| Part Description |
ProASIC3EL Field Programmable Gate Array (FPGA) IC 270 110592 484-BGA |
|---|---|
| Quantity | 303 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 270 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 110592 |
Overview of A3PE600L-1FGG484M – ProASIC3EL Field Programmable Gate Array (FPGA), 270 I/Os, 484-BGA
The A3PE600L-1FGG484M is a ProASIC3EL Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade embedded applications. It delivers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 484-BGA package.
Targeted at systems requiring rugged qualification and a wide operating range, this device is well suited for designs that demand reliable operation across extreme temperatures and formal MIL-STD-883 qualification.
Key Features
- Core Logic 13,824 logic elements (cells) providing approximately 600,000 gates of user logic capacity for complex digital designs.
- On-Chip Memory Approximately 0.11 Mbits of embedded RAM (110,592 total RAM bits) to support buffering, state machines and small data stores.
- I/O Density 270 general-purpose I/O pins to accommodate multiple interfaces, sensor connections and high-pin-count peripheral integration.
- Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V for core power compatibility with platform-level power architectures.
- Package 484-ball fine-pitch BGA (484-FPBGA, 23×23) surface-mount package for a compact footprint and high pin density.
- Temperature & Reliability Qualified to operate from −55 °C to 125 °C and produced to Military grade with MIL-STD-883 qualification for demanding environments.
- Mounting Surface-mount package suitable for modern PCB assembly and high-density board layouts.
- RoHS Compliance Device is RoHS compliant, supporting environmental and assembly process requirements.
Typical Applications
- Military and Defense Systems Use in ruggedized processing, control or interface modules where MIL-STD-883 qualification and extended temperature range are required.
- Avionics and Aerospace Electronics Suitable for on-board data handling, interface bridging and control tasks that need wide temperature operation and military-grade qualification.
- Secure Communications and Signal Processing High logic density and substantial I/O count support custom protocol handling, preprocessing and real-time signal tasks.
- Rugged Embedded Controllers Integration into systems requiring reliable, compact FPGA resources for control logic, state machines and peripheral aggregation.
Unique Advantages
- Military-Grade Qualification: MIL-STD-883 qualification and a designated Military grade ensure the device meets formal reliability standards for defense applications.
- Wide Operating Temperature: −55 °C to 125 °C range supports deployment in extreme and harsh environments without additional thermal derating.
- High Logic and Gate Count: 13,824 logic elements and 600,000 gates enable implementation of substantial custom logic and complex control algorithms on a single device.
- Significant I/O Capacity: 270 I/O pins provide flexibility for multi-channel interfaces, sensor arrays and mixed-signal front-ends.
- Compact, High-Density Package: 484-FPBGA (23×23) ball grid array delivers high pin count in a compact footprint for space-constrained designs.
- Controlled Core Voltage Range: 1.425 V to 1.575 V supply range simplifies power-domain planning for systems with defined core voltage rails.
Why Choose A3PE600L-1FGG484M?
The A3PE600L-1FGG484M is positioned for engineers building robust, military-qualified embedded systems that require a balance of logic capacity, on-chip memory and extensive I/O. Its formal MIL-STD-883 qualification, wide temperature rating and compact 484-BGA package make it suitable for applications where reliability and environmental tolerance are essential.
This device is ideal for design teams that need a single FPGA solution to consolidate control, interface and preprocessing functions while maintaining a compact board footprint and meeting stringent qualification standards. The combination of logic density, RAM and I/O helps reduce BOM complexity and supports long-term deployment in ruggedized platforms.
Request a quote or submit an inquiry today to discuss availability and pricing for the A3PE600L-1FGG484M. Our team can assist with ordering and supply options tailored to your program requirements.

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