A3PE600L-1FGG484M

IC FPGA 270 I/O 484FBGA
Part Description

ProASIC3EL Field Programmable Gate Array (FPGA) IC 270 110592 484-BGA

Quantity 303 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O270Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits110592

Overview of A3PE600L-1FGG484M – ProASIC3EL Field Programmable Gate Array (FPGA), 270 I/Os, 484-BGA

The A3PE600L-1FGG484M is a ProASIC3EL Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade embedded applications. It delivers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 484-BGA package.

Targeted at systems requiring rugged qualification and a wide operating range, this device is well suited for designs that demand reliable operation across extreme temperatures and formal MIL-STD-883 qualification.

Key Features

  • Core Logic 13,824 logic elements (cells) providing approximately 600,000 gates of user logic capacity for complex digital designs.
  • On-Chip Memory Approximately 0.11 Mbits of embedded RAM (110,592 total RAM bits) to support buffering, state machines and small data stores.
  • I/O Density 270 general-purpose I/O pins to accommodate multiple interfaces, sensor connections and high-pin-count peripheral integration.
  • Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V for core power compatibility with platform-level power architectures.
  • Package 484-ball fine-pitch BGA (484-FPBGA, 23×23) surface-mount package for a compact footprint and high pin density.
  • Temperature & Reliability Qualified to operate from −55 °C to 125 °C and produced to Military grade with MIL-STD-883 qualification for demanding environments.
  • Mounting Surface-mount package suitable for modern PCB assembly and high-density board layouts.
  • RoHS Compliance Device is RoHS compliant, supporting environmental and assembly process requirements.

Typical Applications

  • Military and Defense Systems Use in ruggedized processing, control or interface modules where MIL-STD-883 qualification and extended temperature range are required.
  • Avionics and Aerospace Electronics Suitable for on-board data handling, interface bridging and control tasks that need wide temperature operation and military-grade qualification.
  • Secure Communications and Signal Processing High logic density and substantial I/O count support custom protocol handling, preprocessing and real-time signal tasks.
  • Rugged Embedded Controllers Integration into systems requiring reliable, compact FPGA resources for control logic, state machines and peripheral aggregation.

Unique Advantages

  • Military-Grade Qualification: MIL-STD-883 qualification and a designated Military grade ensure the device meets formal reliability standards for defense applications.
  • Wide Operating Temperature: −55 °C to 125 °C range supports deployment in extreme and harsh environments without additional thermal derating.
  • High Logic and Gate Count: 13,824 logic elements and 600,000 gates enable implementation of substantial custom logic and complex control algorithms on a single device.
  • Significant I/O Capacity: 270 I/O pins provide flexibility for multi-channel interfaces, sensor arrays and mixed-signal front-ends.
  • Compact, High-Density Package: 484-FPBGA (23×23) ball grid array delivers high pin count in a compact footprint for space-constrained designs.
  • Controlled Core Voltage Range: 1.425 V to 1.575 V supply range simplifies power-domain planning for systems with defined core voltage rails.

Why Choose A3PE600L-1FGG484M?

The A3PE600L-1FGG484M is positioned for engineers building robust, military-qualified embedded systems that require a balance of logic capacity, on-chip memory and extensive I/O. Its formal MIL-STD-883 qualification, wide temperature rating and compact 484-BGA package make it suitable for applications where reliability and environmental tolerance are essential.

This device is ideal for design teams that need a single FPGA solution to consolidate control, interface and preprocessing functions while maintaining a compact board footprint and meeting stringent qualification standards. The combination of logic density, RAM and I/O helps reduce BOM complexity and supports long-term deployment in ruggedized platforms.

Request a quote or submit an inquiry today to discuss availability and pricing for the A3PE600L-1FGG484M. Our team can assist with ordering and supply options tailored to your program requirements.

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