A3PN010-1QNG48I

The A3PN010-1QNG48I is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC offered in a 48-VFQFN exposed pad package. It provides a compact, industrial-grade FPGA option with 260 logic elements (approximately 10,000 gates) and 34 general-purpose I/O pins for small to mid-scale programmable logic integration.

Designed for surface-mount assembly and industrial temperature ranges, this device supports a core supply voltage range of 1.425 V to 1.575 V and is RoHS compliant, enabling deployment in temperature-challenging embedded systems that require reliable programmable logic in a 6 × 6 mm QFN footprint.

Key Features

• Core Logic 260 logic elements (reported as 260 LABs/CLBs) corresponding to roughly 10,000 gates of programmable logic capacity for implementing glue logic, finite-state machines, and small custom accelerators.
• I/O 34 general-purpose I/O pins suitable for interfacing sensors, peripherals, and control signals in compact systems.
• Memory Total on-chip RAM reported as 0 bits (no embedded SRAM blocks), enabling predictable, tightly constrained logic designs where external memory or register-based architectures are used.
• Power Operates from a core supply voltage between 1.425 V and 1.575 V, allowing precise power budgeting in regulated embedded environments.
• Package & Mounting 48-VFQFN exposed pad (48-QFN, 6×6 mm) surface-mount package for compact board designs with thermal pad support for improved heat dissipation.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for many industrial embedded applications.
• Compliance RoHS compliant, supporting environmental and manufacturing requirements for lead-free assemblies.

Typical Applications

• Industrial Control — Implements compact programmable logic and I/O interfacing in control modules that require industrial temperature operation and a small PCB footprint.
• Embedded Signal Glue Logic — Serves as on-board programmable glue logic to interconnect peripherals, manage signal conditioning, and implement custom finite-state machines.
• Compact Consumer/Equipment Interfaces — Provides flexible I/O and logic capacity in a 6×6 mm QFN package for space-constrained products requiring configurable control and interfacing.

Unique Advantages

• Compact, exposed-pad QFN package: 48-VFQFN (6×6) package reduces PCB area while the exposed pad supports thermal management in dense assemblies.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Right-sized logic capacity: 260 logic elements (≈10,000 gates) provide sufficient programmable resources for glue logic and modest custom functions without excess complexity.
• Predictable memory footprint: Reported total on-chip RAM of 0 bits simplifies timing and resource planning for register-centric designs.
• Surface-mount friendly: Standard QFN footprint and RoHS compliance ease integration into modern manufacturing flows.

Why Choose A3PN010-1QNG48I?

The A3PN010-1QNG48I positions itself as a compact, industrial-grade FPGA option for designs that require modest logic capacity, reliable operation across a wide temperature range, and a small surface-mount package. Its 34 I/O pins and 260 logic elements make it well suited for embedded control, interface logic, and compact programmable tasks where board space and thermal considerations matter.

For engineers and procurement teams building industrial embedded systems, this device offers a clear balance of integration, predictable resource sizing, and manufacturability backed by RoHS compliance and a standard 48-QFN footprint.

Request a quote or submit a purchase inquiry today to evaluate the A3PN010-1QNG48I for your next embedded or industrial FPGA design.