A3PE600L-FG484M

The A3PE600L-FG484M is a ProASIC3EL field programmable gate array (FPGA) from Microchip Technology designed for military-grade embedded applications. It provides a high logic capacity FPGA fabric with integrated on-chip memory and a large I/O complement, paired with MIL-STD-883 qualification and a wide operating temperature range for deployment in harsh environments.

Key Features

• Logic Capacity  13,824 logic elements (CLBs) and approximately 600,000 gates to implement complex digital functions and control logic.
• Embedded Memory  110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small-data processing tasks.
• I/O Resource  270 programmable I/Os to connect to sensors, peripherals, and external subsystems.
• Power Supply  Core voltage supply range of 1.425 V to 1.575 V to match system power architectures.
• Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting for high-density PCB integration.
• Environmental & Qualification  Military grade with MIL-STD-883 qualification and RoHS compliance; operating temperature range −55 °C to 125 °C for extended-environment reliability.

Typical Applications

• Military & Defense Systems  Suitable for embedded processing, control, and signal logic in systems requiring MIL-STD-883 qualification and extended temperature operation.
• Harsh-Environment Embedded Electronics  Deploy in rugged platforms where wide operating temperature range and military-grade qualification are required.
• High-Density Board Designs  Use where a compact 484-BGA surface-mount package and a large number of I/Os enable dense system integration.

Unique Advantages

• MIL-STD-883 Qualification: Qualified to MIL-STD-883, supporting use in military-grade applications that require documented qualification.
• High Logic & Gate Count: 13,824 logic elements and 600,000 gates provide capacity for complex digital designs without external glue logic.
• Significant I/O Count: 270 I/Os simplify interfacing to multiple peripherals and subsystems, reducing the need for external expanders.
• Wide Temperature Range: −55 °C to 125 °C operation enables deployment in demanding thermal environments.
• Compact BGA Packaging: 484-BGA (23×23) surface-mount package supports high-density PCB layouts while maintaining robust connections.
• Regulatory Compliance: RoHS compliant to meet environmental requirements for assembly and deployment.

Why Choose A3PE600L-FG484M?

The A3PE600L-FG484M positions itself as a rugged, capable FPGA choice for military and harsh-environment embedded systems, combining substantial logic capacity, on-chip memory, and a large I/O set with MIL-STD-883 qualification and a wide operating temperature window. Its 484-BGA surface-mount package and defined core voltage range make it suitable for compact, high-density board designs where reliability and qualification are essential.

Manufactured by Microchip Technology, this device is intended for designers who need a qualified FPGA building block that balances logic resources, I/O connectivity, and environmental robustness for long-term deployment in demanding applications.

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