A3PN010-1QNG48
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad |
|---|---|
| Quantity | 855 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 48-QFN (6x6) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | Number of I/O | 34 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 260 | Number of Logic Elements/Cells | 260 | ||
| Number of Gates | 10000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN010-1QNG48 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 34 I/O, 48-VFQFN Exposed Pad
The A3PN010-1QNG48 is a ProASIC3 nano FPGA IC from Microchip Technology designed for commercial-grade applications that require compact, programmable logic. It provides 260 logic elements cells and 34 general-purpose I/Os in a 48-VFQFN exposed pad package, making it suitable for space-constrained designs that need deterministic, configurable logic capacity.
This device operates from a 1.425 V to 1.575 V supply and is specified for an operating temperature range of −20 °C to 85 °C. It is RoHS compliant and supplied in a surface-mount 48-QFN (6×6) package with an exposed pad for thermal and grounding considerations.
Key Features
- Core Logic Capacity 260 logic elements cells providing fixed, verified logic resources suitable for compact programmable designs.
- General-Purpose I/O 34 I/O pins to support multiple peripheral connections and simple interface tasks.
- Package 48-VFQFN exposed pad (supplier device package: 48-QFN, 6×6) in a surface-mount format for compact board layouts and improved thermal conduction.
- Power Supply Low-voltage operation with a specified supply range of 1.425 V to 1.575 V for designs targeting tight power rails.
- Operating Temperature Commercial temperature rating from −20 °C to 85 °C for standard commercial environments.
- Memory No on-chip embedded RAM (Total RAM Bits: 0), providing a deterministic logic-only resource profile.
- Compliance RoHS compliant for environmental regulatory alignment in commercial products.
Typical Applications
- Commercial embedded systems Systems that require up to 260 logic elements and 34 I/Os in a compact surface-mount package.
- Interface bridging and I/O consolidation Designs that need configurable I/O mapping and simple logic functions in a small footprint.
- Prototyping and low-density programmable logic Development boards and prototypes where a modest number of logic elements and I/Os are sufficient.
Unique Advantages
- Compact, exposed-pad package: 48-VFQFN / 48-QFN (6×6) package reduces board area while providing an exposed pad for thermal and grounding benefits.
- Predictable logic capacity: 260 logic elements cells and 10,000 gates offer a clear, deterministic resource budget for design planning.
- Low-voltage operation: Narrow supply range (1.425 V–1.575 V) helps designs with specific low-voltage power rails maintain stability.
- Commercial temperature rating: Specified for −20 °C to 85 °C to meet typical commercial deployment conditions.
- RoHS compliant: Environmentally compliant for commercial product manufacturing and assembly.
- Surface-mount readiness: 48-lead QFN format supports automated assembly processes for volume production.
Why Choose A3PN010-1QNG48?
The A3PN010-1QNG48 delivers a compact, logic-focused FPGA solution for commercial designs that need a modest number of logic elements and a moderate I/O count in a space-efficient package. Backed by Microchip Technology, this ProASIC3 nano device is aimed at designers who require deterministic logic capacity, low-voltage operation, and a small surface-mount footprint.
It suits projects and products where integration, predictable resource allocation, and RoHS compliance matter. The device’s exposed-pad QFN package supports thermal management and reliable board-level integration for sustained commercial use.
Request a quote or submit a product inquiry to get pricing and availability for the A3PN010-1QNG48.

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