A3PN010-1QNG48

IC FPGA 34 I/O 48QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad

Quantity 855 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package48-QFN (6x6)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case48-VFQFN Exposed PadNumber of I/O34Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs260Number of Logic Elements/Cells260
Number of Gates10000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN010-1QNG48 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 34 I/O, 48-VFQFN Exposed Pad

The A3PN010-1QNG48 is a ProASIC3 nano FPGA IC from Microchip Technology designed for commercial-grade applications that require compact, programmable logic. It provides 260 logic elements cells and 34 general-purpose I/Os in a 48-VFQFN exposed pad package, making it suitable for space-constrained designs that need deterministic, configurable logic capacity.

This device operates from a 1.425 V to 1.575 V supply and is specified for an operating temperature range of −20 °C to 85 °C. It is RoHS compliant and supplied in a surface-mount 48-QFN (6×6) package with an exposed pad for thermal and grounding considerations.

Key Features

  • Core Logic Capacity  260 logic elements cells providing fixed, verified logic resources suitable for compact programmable designs.
  • General-Purpose I/O  34 I/O pins to support multiple peripheral connections and simple interface tasks.
  • Package  48-VFQFN exposed pad (supplier device package: 48-QFN, 6×6) in a surface-mount format for compact board layouts and improved thermal conduction.
  • Power Supply  Low-voltage operation with a specified supply range of 1.425 V to 1.575 V for designs targeting tight power rails.
  • Operating Temperature  Commercial temperature rating from −20 °C to 85 °C for standard commercial environments.
  • Memory  No on-chip embedded RAM (Total RAM Bits: 0), providing a deterministic logic-only resource profile.
  • Compliance  RoHS compliant for environmental regulatory alignment in commercial products.

Typical Applications

  • Commercial embedded systems  Systems that require up to 260 logic elements and 34 I/Os in a compact surface-mount package.
  • Interface bridging and I/O consolidation  Designs that need configurable I/O mapping and simple logic functions in a small footprint.
  • Prototyping and low-density programmable logic  Development boards and prototypes where a modest number of logic elements and I/Os are sufficient.

Unique Advantages

  • Compact, exposed-pad package: 48-VFQFN / 48-QFN (6×6) package reduces board area while providing an exposed pad for thermal and grounding benefits.
  • Predictable logic capacity: 260 logic elements cells and 10,000 gates offer a clear, deterministic resource budget for design planning.
  • Low-voltage operation: Narrow supply range (1.425 V–1.575 V) helps designs with specific low-voltage power rails maintain stability.
  • Commercial temperature rating: Specified for −20 °C to 85 °C to meet typical commercial deployment conditions.
  • RoHS compliant: Environmentally compliant for commercial product manufacturing and assembly.
  • Surface-mount readiness: 48-lead QFN format supports automated assembly processes for volume production.

Why Choose A3PN010-1QNG48?

The A3PN010-1QNG48 delivers a compact, logic-focused FPGA solution for commercial designs that need a modest number of logic elements and a moderate I/O count in a space-efficient package. Backed by Microchip Technology, this ProASIC3 nano device is aimed at designers who require deterministic logic capacity, low-voltage operation, and a small surface-mount footprint.

It suits projects and products where integration, predictable resource allocation, and RoHS compliance matter. The device’s exposed-pad QFN package supports thermal management and reliable board-level integration for sustained commercial use.

Request a quote or submit a product inquiry to get pricing and availability for the A3PN010-1QNG48.

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