A3PE600L-FGG484M

The A3PE600L-FGG484M is a ProASIC3EL field programmable gate array (FPGA) supplied in a 484-BGA package. It delivers a high-density programmable logic resource set combined with a substantial I/O count and on-chip memory, targeted for applications requiring military-grade qualification and extended temperature operation.

Designed for deployment in environments that demand rugged, qualified components, this device provides 13,824 logic elements (approximately 600,000 gates), 270 I/O pins, and approximately 0.11 Mbits of embedded RAM in a compact surface-mount BGA footprint.

Key Features

• Logic Capacity 13,824 logic elements and 600,000 gates provide a high level of combinational and sequential logic resources for complex digital designs.
• Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffering, state storage, and small-scale data handling without external memory.
• I/O Density 270 I/O pins to enable broad connectivity to peripherals, sensors, and external devices.
• Power Supply Operates from a defined core voltage range of 1.425 V to 1.575 V, enabling predictable power budgeting in regulated designs.
• Package and Mounting 484-FPBGA (23×23) / 484-BGA package case, surface-mount mounting type for board-level integration in space-constrained assemblies.
• Temperature and Qualification Military grade with an operating temperature range of −55°C to 125°C and qualification to MIL-STD-883 for use in demanding environmental conditions.
• Compliance RoHS compliant.

Typical Applications

• Military and Aerospace Systems Suitable for designs that require MIL-STD-883 qualification and wide temperature range operation.
• High-Density Digital Logic Used where large programmable logic counts and flexible I/O are needed to implement custom processing, control, or interface functions.
• Embedded Control Deployed in embedded control and timing-critical applications that benefit from on-chip RAM and extensive I/O connectivity.

Unique Advantages

• Military-Qualified Reliability: MIL-STD-883 qualification and −55°C to 125°C operating range support long-term use in harsh environments.
• High Logic Integration: 13,824 logic elements and 600,000 gates allow substantial functionality to be implemented on a single device, reducing board-level complexity.
• Generous I/O Count: 270 I/O pins provide flexibility for multiple interfaces and dense peripheral connections without external expanders.
• Compact BGA Footprint: 484-FPBGA (23×23) package offers a space-efficient solution for high-density PCB layouts.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM for local buffering and state storage, minimizing the need for external memory in many designs.
• Regulated Core Voltage Range: Defined supply window (1.425 V–1.575 V) supports predictable power design and integration.

Why Choose A3PE600L-FGG484M?

The A3PE600L-FGG484M positions itself as a robust, military-grade FPGA option that balances high logic density, extensive I/O, and on-chip memory within a compact BGA package. Its MIL-STD-883 qualification and wide operating temperature range make it suitable for long-term deployment in demanding environments where reliability and predictable operation are required.

This device is well suited to engineers and procurement teams designing systems that need a qualified FPGA with significant logic resources and connectivity, such as defense, aerospace, and other ruggedized electronic applications.

Request a quote or submit an inquiry for pricing and availability to begin integrating the A3PE600L-FGG484M into your next qualified design.