A3PE600-FGG484I

The A3PE600-FGG484I is a ProASIC3E field programmable gate array from Microchip Technology, providing a programmable fabric for implementing customized digital logic. It combines a mid-range logic capacity with a high I/O count and industrial-grade operating range, making it suitable for embedded and industrial designs that require flexible logic integration and robust temperature performance.

Key Features

• Core Logic  13,824 logic elements (cells) and an equivalent of 600,000 gates for implementing customized digital functions.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support local buffering and state storage.
• I/O Capability  270 user I/O pins for dense interfacing to peripherals, sensors, and external devices.
• Power  Core voltage supply range of 1.425 V to 1.575 V for device operation.
• Package & Mounting  484-ball fine-pitch BGA package (484-FPBGA, 23×23) with surface-mount mounting for compact board integration.
• Operating Range  Industrial temperature grade with specified operation from −40 °C to 100 °C for deployment in harsh environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use the device for control logic, I/O aggregation, and protocol bridging where an industrial temperature range and dense I/O are required.
• Embedded Systems  Implement custom peripheral interfaces and glue logic in compact embedded platforms leveraging the device's logic elements and I/O count.
• Signal Management  Deploy the FPGA for data buffering, simple signal processing, and timing control using on-chip RAM and programmable logic.

Unique Advantages

• High Logic Density: 13,824 logic elements provide substantial room for mid-range digital designs without external glue logic.
• Significant On-Chip Memory: Approximately 0.11 Mbits of embedded RAM supports local storage for buffers, FIFOs, and state machines.
• Extensive I/O: 270 I/O pins enable wide connectivity for sensor arrays, peripherals, and multi-channel interfaces.
• Industrial Robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Compact BGA Packaging: 484-ball FPBGA (23×23) allows high-density board layouts while maintaining a surface-mount form factor.
• Controlled Core Voltage: Narrow core supply range (1.425 V–1.575 V) for predictable power design and supply management.

Why Choose A3PE600-FGG484I?

The A3PE600-FGG484I is positioned for engineers needing a mid-range FPGA that balances logic capacity, embedded memory, and a high I/O count in an industrial-grade package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 270 user I/Os makes it well-suited to embedded and industrial designs requiring flexible digital implementation and robust temperature performance.

Backed by Microchip Technology, this ProASIC3E device offers a practical option for designers seeking scalable, reprogrammable logic in a compact 484-BGA package with RoHS compliance.

Request a quote or submit a request for pricing and availability to begin evaluating the A3PE600-FGG484I for your next design.