A3PE600-FGG256

The A3PE600-FGG256 is a ProASIC3E Field Programmable Gate Array (FPGA) IC optimized for designs requiring moderate logic density and flexible I/O. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory, packaged in a compact 256-LBGA footprint.

With 165 available I/O, a 1.425 V to 1.575 V core supply range, and commercial operating temperature ratings, this device is intended for applications that need reconfigurable logic capacity, on-chip memory, and a high I/O count in a surface-mount BGA package.

Key Features

• Core Logic  13,824 logic elements (equivalent reported logic density) and approximately 600,000 gates to implement a wide range of digital functions.
• Embedded Memory  Total on-chip RAM of 110,592 bits—approximately 0.11 Mbits—for buffering, state storage, and small data tables.
• I/O Capacity  165 general-purpose I/O pins to support multiple peripherals and parallel interfaces.
• Power Supply  Specified core voltage range from 1.425 V to 1.575 V for system power planning and regulator selection.
• Package & Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) designed for surface-mount assembly in space-constrained PCBs.
• Operating Conditions  Commercial grade, operating temperature range 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Embedded logic and glue logic  Use the device’s 13,824 logic elements to implement custom control, protocol bridging, and system glue in embedded designs.
• I/O expansion and interface control  165 I/O pins enable handling multiple peripheral interfaces and parallel connections on a single FPGA.
• On-board data buffering  Approximately 0.11 Mbits of embedded RAM supports small buffers, FIFOs, and state storage for data-path and control logic.

Unique Advantages

• Balanced logic and gate count  13,824 logic elements and 600,000 gates provide the capacity to implement moderate-complexity digital designs without excessive over-specification.
• Compact BGA packaging  256-LBGA (17×17) keeps board footprint small while delivering a high I/O count.
• Defined low-voltage core  A narrowly specified 1.425 V–1.575 V supply simplifies power-supply design for stable core operation.
• Commercial temperature rating  0 °C to 85 °C operating range aligns with a wide set of commercial and industrial-adjacent applications.
• Regulatory readiness  RoHS compliance supports lead-free and environmentally conscious manufacturing flows.

Why Choose A3PE600-FGG256?

The A3PE600-FGG256 delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 256-LBGA package. Its specified voltage range and commercial temperature rating make it suitable for designs that require stable, reprogrammable logic in space-constrained board layouts.

This device is well suited for developers and designers who need a reliable FPGA building block with defined on-chip resources—logic elements, memory, and I/O count—backed by RoHS compliance for modern production requirements.

Request a quote or submit a sales inquiry to receive pricing and availability information for the A3PE600-FGG256 and to discuss how it can fit into your next design.