A3PE600-FG256I

The A3PE600-FG256I is a ProASIC3E Field Programmable Gate Array (FPGA) IC providing 13,824 logic elements and 165 general-purpose I/Os in a compact 256-ball LBGA package. Designed for industrial-grade applications, this device delivers a balanced combination of logic capacity, embedded memory, and I/O density for custom digital designs operating across a wide temperature and supply range.

Key Features

• Core Logic  Approximately 13,824 logic elements (13824) and 600,000 equivalent gates provide mid-range programmable logic capacity for custom control and processing functions.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for localized buffering, state storage, and small lookup tables.
• I/O Density  165 I/O pins enable a broad range of external interfacing and parallel connectivity options for sensors, actuators, and peripheral devices.
• Power Supply  Specified core voltage supply range of 1.425 V to 1.575 V for predictable power management and supply planning.
• Package and Mounting  256-ball LBGA package; supplier device package listed as 256-FPBGA (17×17). Surface-mount mounting type supports conventional PCB assembly.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet the thermal requirements of many industrial environments.
• Regulatory  RoHS compliant, supporting lead-free assembly and environmental compliance goals.

Typical Applications

• Industrial control systems  Use the device’s logic capacity and 165 I/Os to implement custom control logic, signal conditioning, and real-time interfacing in industrial automation environments.
• Embedded processing and glue-logic  Leverage 13,824 logic elements and on-chip RAM to consolidate peripheral interfacing, protocol bridging, and custom datapath functions in embedded designs.
• I/O expansion and protocol conversion  High I/O count enables flexible interfacing and protocol adaptation between multiple subsystems and external devices.

Unique Advantages

• Balanced logic and memory  13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM allow implementation of moderately complex state machines and buffering without external memory.
• Substantial I/O capacity  165 I/Os reduce the need for external I/O expanders and simplify board-level connectivity for multi-sensor or multi-peripheral systems.
• Industrial-temperature rating  Operation from –40 °C to 100 °C supports deployment in demanding thermal environments common to industrial applications.
• Compact, assembly-ready package  256-LBGA (256-FPBGA, 17×17) and surface-mount mounting enable space-efficient PCB integration and standard manufacturing processes.
• Predictable power requirements  Defined core supply range (1.425 V–1.575 V) simplifies power supply design and validation.
• RoHS compliance  Supports lead-free assembly and regulatory alignment for environmentally conscious production.

Why Choose A3PE600-FG256I?

The A3PE600-FG256I positions itself as a practical, industrial-grade FPGA choice for designs that require a balance of logic density, embedded RAM, and substantial I/O capability within a compact LBGA footprint. Its specified operating temperature range and RoHS compliance make it suitable for robust production environments where environmental durability and regulatory alignment matter.

This device is well suited to engineers building industrial control, embedded processing, or I/O-rich systems who need predictable power requirements, moderate on-chip memory, and a reliable package for surface-mount PCB integration.

Request a quote or submit a procurement inquiry to check availability and pricing for the A3PE600-FG256I. Our team can provide lead-time and ordering information to support your project timelines.