A3PE600-2FGG256I

The A3PE600-2FGG256I is a ProASIC3E family Field Programmable Gate Array from Microchip Technology. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory in a compact 256-LBGA package for surface-mount PCB assembly.

Designed for industrial applications, this device delivers a balance of I/O density (165 I/Os), logic capacity (600,000 gates), and a controlled core supply range (1.425–1.575 V) with an extended operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic – 13,824 logic elements supporting up to 600,000 gates for mid-density programmable logic implementations.
• Embedded Memory – Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for local data buffering and small lookup-table storage.
• I/O Density – 165 I/O pins to support a wide range of digital interfaces and peripheral connections.
• Power – Specified core voltage supply range of 1.425 V to 1.575 V to match system power-rail designs requiring this voltage window.
• Package & Mounting – 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for space-efficient board layouts.
• Temperature & Grade – Industrial grade with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance – RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Automation – Implement control logic, I/O aggregation, and protocol bridging in factory and machine-control equipment benefiting from industrial temperature capability.
• Communications & Networking – Provide mid-density programmable logic and multiple I/Os for interface adaptation, packet handling, or timing functions in networking modules.
• Test & Measurement – Integrate custom data path logic and small embedded buffers for instrumentation, data acquisition, and signal conditioning tasks.
• Embedded System Control – Serve as the programmable control fabric for OEM devices and embedded platforms requiring flexible logic, I/O, and compact packaging.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements combined with ~0.11 Mbits of embedded memory provide a practical mid-range resource set for many control and interface designs.
• High I/O Count: 165 I/Os enable direct connectivity to multiple peripherals and external devices, reducing the need for extra interface components.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support deployment in harsher operating environments.
• Compact, Surface-Mount BGA Package: 256-LBGA (256-FPBGA, 17×17) delivers a small footprint for space-constrained PCBs while maintaining routing density.
• Controlled Core Voltage: Narrow supply window (1.425–1.575 V) that aligns with precise power designs and system-level voltage management.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose A3PE600-2FGG256I?

The A3PE600-2FGG256I positions itself as a mid-density, industrial-grade FPGA solution for designs that need a combination of ample logic resources, meaningful on-chip memory, and a high number of I/Os in a compact package. Its specified voltage range and extended temperature rating make it suitable for industrial and embedded control applications where reliability across environments matters.

Backed by Microchip Technology manufacturing, this device is appropriate for OEMs, system integrators, and engineers seeking a programmable logic device that balances integration, thermal robustness, and board-area efficiency for production and long-term deployments.

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