A3PE600-2FGG484

The A3PE600-2FGG484 is a ProASIC3E family FPGA from Microchip Technology designed for commercial-grade programmable logic applications. It provides a balanced combination of logic capacity, I/O density and on-chip memory in a compact 484-ball fine-pitch BGA package, making it suitable for space-constrained embedded designs that require reconfigurable logic and high pin count.

Key Features

• Core Logic  13,824 logic elements delivering up to 600,000 gates of programmable logic capacity for implementing custom digital functions and moderate-complexity designs.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) suitable for small buffers, FIFOs and local data storage.
• I/O Density  270 I/O pins to support multiple external interfaces and parallel connections in high-pin-count applications.
• Package & Mounting  484-ball FPBGA (23 × 23) surface-mount package for compact board-level integration and robust soldered connection.
• Supply Voltage  Operates from 1.425 V to 1.575 V to match low-voltage core domains and system power rails.
• Operating Range & Grade  Commercial-grade device specified for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for environmental safety.

Typical Applications

• Embedded system logic  Programmable glue logic and custom datapath implementation in compact embedded platforms.
• Interface bridging  High I/O count supports protocol translation and parallel interface aggregation between subsystems.
• Prototyping and evaluation  Reconfigurable logic capacity suitable for proof-of-concept designs and iterative hardware development.

Unique Advantages

• Substantial logic capacity: 13,824 logic elements and 600,000 gates provide designers with the resources to implement moderate-complexity digital systems without external ASICs.
• High I/O count: 270 I/Os enable flexible connectivity for sensors, memory interfaces and multiple peripheral buses, reducing board-level multiplexing.
• Compact BGA footprint: 484-ball (23 × 23) FPBGA package delivers a high-pin-count solution in a space-efficient surface-mount form factor.
• On-chip RAM: Approximately 0.11 Mbits of embedded memory supports local buffering and small data structures, simplifying system memory architecture.
• Controlled voltage domain: Narrow supply range (1.425 V–1.575 V) helps ensure stable core operation and predictable power design.
• RoHS compliant: Environmentally compliant manufacturing supports lead-free assembly and regulatory requirements.

Why Choose A3PE600-2FGG484?

The A3PE600-2FGG484 positions itself as a practical commercial-grade FPGA option for engineers seeking a balance of logic resources, I/O density and on-chip memory in a compact BGA package. Its 13,824 logic elements, 270 I/Os and 110,592 RAM bits address a wide range of embedded and interface-oriented designs where board space and pin count matter.

Manufactured by Microchip Technology, this device is suitable for development teams and procurement groups looking for a reconfigurable solution that fits moderate-complexity digital tasks while meeting RoHS requirements and standard commercial temperature needs.

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