A3PE600-2FG484I

The A3PE600-2FG484I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology offered in a 484-ball BGA package. It provides a high-density logic fabric with substantial I/O capacity and embedded memory for programmable digital designs.

Built and graded for industrial use, this surface-mount FPGA is suited to designs that require dense logic, a large number of I/Os, and operation across an extended temperature range.

Key Features

• Logic Capacity 13,824 logic elements (cells) and approximately 600,000 gates to implement complex programmable logic functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for local data storage and buffering.
• I/O Density 270 user I/Os to support broad connectivity and multiple peripheral interfaces.
• Power Operates from a specified supply range of 1.425 V to 1.575 V for core power.
• Package and Mounting 484-BGA package (Supplier device package: 484-FPBGA (23x23)) in a surface-mount form factor for high-pin-count board designs.
• Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Programmable logic for control systems where extended temperature operation and industrial-grade components are required.
• Embedded Systems Integration of custom digital functions and glue logic within embedded platforms that need significant logic density and I/O.
• High I/O Interface Modules Designs requiring a large number of user I/Os for signal aggregation, bridging, or protocol conversion.

Unique Advantages

• High-density programmable logic: 13,824 logic elements and about 600,000 gates enable implementation of substantial custom logic on a single device, reducing board-level complexity.
• Significant I/O count: 270 I/Os support broad external connectivity without multiple interface chips.
• Embedded memory on-chip: 110,592 bits of RAM provide local storage for buffering and state retention, minimizing external memory needs.
• Industrial-rated operation: −40°C to 100°C specification aligns with industrial application requirements for wider operating ranges.
• Compact, high-pin-count package: 484-FPBGA (23×23) enables high I/O and routing density in a surface-mount form factor.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose A3PE600-2FG484I?

The A3PE600-2FG484I positions itself as a robust, industrial-grade programmable logic option for designs that need a balance of high logic density, extensive I/O, and embedded memory in a compact BGA package. Its voltage and temperature specifications make it suitable for applications operating under industrial conditions.

Backed by Microchip Technology, this ProASIC3E device is appropriate for engineers and procurement teams seeking a reliable FPGA with the capacity to consolidate logic, reduce external components, and support long-term deployments in industrial and embedded systems.

Request a quote or contact sales to check availability and pricing for the A3PE600-2FG484I and to discuss how it can fit into your next design.