A3PE600-2FG256

The A3PE600-2FG256 is a ProASIC3E FPGA from Microchip Technology designed for commercial embedded designs that require moderate logic density and a compact BGA footprint. It integrates 13,824 logic elements and approximately 0.108 Mbits of on-chip RAM to implement custom logic, control functions, and I/O consolidation on a single device.

With 165 user I/O signals, a 256-FPBGA (17×17) surface-mount package, a single supply voltage of 1.425 V, and a commercial operating range of 0 °C to 85 °C, this device targets board-level applications where space, I/O count, and controlled power rails are key design drivers.

Key Features

• Logic Capacity  13,824 logic elements and approximately 600,000 gates provide the resource budget for implementing medium-complexity digital functions.
• Embedded Memory  Approximately 0.108 Mbits of on-chip RAM for local storage, buffering, and state machines.
• I/O Count  165 user I/Os to support dense peripheral connectivity and parallel interfaces at the board level.
• Power  Single voltage supply of 1.425 V simplifies power delivery and voltage rail planning.
• Package & Mounting  256-FPBGA (17×17) supplier device package in a tray format; surface-mount assembly suitable for compact PCBs.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operating temperature.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, protocol bridging, and control tasks where a medium-density FPGA and 165 I/Os streamline board design.
• Compact I/O Consolidation  Replace multiple discrete glue-logic devices with a single FPGA to reduce BOM and PCB area in space-constrained designs.
• Prototype and Evaluation Systems  Use the device’s logic and memory resources to validate algorithms and hardware partitions prior to production.

Unique Advantages

• High Logic Density: 13,824 logic elements and ~600,000 gates let you integrate substantial digital functionality into a single device.
• Significant On-Chip Memory: Approximately 0.108 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Extensive I/O: 165 I/Os enable broad peripheral connectivity and parallel interface options without additional I/O expanders.
• Compact BGA Package: 256-FPBGA (17×17) reduces PCB footprint while supporting surface-mount assembly workflows.
• Single-Supply Simplicity: Fixed 1.425 V supply requirement simplifies power-supply design when targeting compatible board architectures.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns the device with a wide range of commercial product deployments.

Why Choose A3PE600-2FG256?

The A3PE600-2FG256 strikes a balance between logic capacity, embedded memory, and I/O density in a compact BGA package, making it well suited for commercial designs that require consolidated digital functions and moderate on-chip resources. Its single-voltage supply and surface-mount 256-FPBGA package enable efficient board-level integration where PCB area and I/O count matter.

Backed by Microchip Technology, this ProASIC3E device is appropriate for design teams building commercial embedded products, prototypes, and boards that need a reliable FPGA with clearly defined electrical and thermal limits.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the A3PE600-2FG256. Our team can assist with lead times and order placement.