A3PE600-1FGG484I

The A3PE600-1FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology designed for applications requiring substantial logic capacity and I/O density in an industrial-grade package. It integrates 13,824 logic elements with approximately 110,592 bits of embedded RAM and supports up to 270 general-purpose I/O lines.

Packaged as a 484-ball FPBGA (23 × 23 mm) and rated for an extended operating range, the device targets designs that need high gate counts, significant on-chip memory, and reliable operation across a wide temperature and supply range.

Key Features

• Logic Capacity — 13,824 logic elements providing a total of 600,000 gates for implementing complex programmable logic.
• Embedded Memory — Approximately 110,592 bits of on-chip RAM to support local buffering, state storage, and intermediate data processing.
• I/O Density — Up to 270 I/Os to accommodate designs with extensive peripheral or interface requirements.
• Package and Mounting — 484-ball FPBGA (484-BGA) in a 23 × 23 mm footprint, optimized for surface-mount assembly.
• Power Supply — Specified core voltage range of 1.425 V to 1.575 V for predictable power design and regulation.
• Industrial Temperature Range — Rated to operate from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and materials.

Typical Applications

• High-density I/O systems — Designs that require up to 270 I/Os for interfacing multiple peripherals, sensors, or parallel buses.
• Memory-anchored logic — Applications needing on-chip RAM (approximately 110,592 bits) for buffering, FIFOs, or small data stores.
• Industrial equipment — Systems operating across -40 °C to 100 °C where industrial-grade components and reliable thermal performance are required.

Unique Advantages

• Substantial logic integration: 13,824 logic elements and 600,000 gates enable complex logic consolidation that can reduce external components and board complexity.
• Ample on-chip RAM: Approximately 110,592 bits of embedded memory provide local storage for data-intensive tasks without relying on external RAM.
• High I/O count: 270 I/Os support diverse interfacing needs, minimizing the need for external I/O expanders.
• Industrial operating range: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA package: 484-ball FPBGA (23 × 23 mm) offers a high-density footprint for space-constrained PCBs while enabling surface-mount assembly.
• Manufacturer support: Backed by Microchip Technology documentation and resources for design reference and integration guidance.

Why Choose A3PE600-1FGG484I?

The A3PE600-1FGG484I combines significant programmable logic capacity, on-chip memory, and a high I/O count in a rugged, industrial-grade FPBGA package. Its defined core voltage range and extended temperature rating make it a suitable candidate for designs where predictable electrical characteristics and thermal robustness matter.

This device is well suited to engineers building systems that require dense logic consolidation, local RAM for intermediate storage, and many external interfaces—providing a balance of integration and reliability backed by Microchip Technology documentation.

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