A3PE600-1FGG256I

The A3PE600-1FGG256I is a ProASIC3E flash-based FPGA from Microchip Technology. It provides a fabric of 13,824 logic elements with approximately 0.11 Mbits of embedded RAM and up to 165 general-purpose I/O pins in a compact 256-LBGA package.

Specified for industrial-grade operation with an extended temperature range and RoHS compliance, this device is well suited for designs that require a balance of logic capacity, on-chip memory, and a high pin count within a surface-mount BGA footprint.

Key Features

• Core Capacity 13,824 logic elements and approximately 600,000 gates provide a medium-density FPGA fabric for custom logic and glue-logic implementations.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support buffering, FIFOs, and small data-store functions within the FPGA fabric.
• I/O Density 165 I/O pins to support multiple parallel interfaces, sensor arrays, or mixed-signal peripheral connections.
• Power and Supply Operates from a core voltage supply range of 1.425 V to 1.575 V to match system power-rail requirements for the FPGA core.
• Package and Mounting 256-LBGA (Supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for space-efficient PCBs and reliable soldered connections.
• Industrial Temperature Grade Specified operating temperature range of −40 °C to 100 °C for deployment in environments with extended temperature demands.
• Regulatory Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control Devices requiring industrial-grade temperature operation and reliable surface-mount packaging can use this FPGA for real-time control logic and interface bridging.
• I/O-Intensive Interfaces Designs that need a high number of general-purpose I/Os—up to 165 pins—benefit from the device’s ability to handle multiple parallel or mixed-signal interfaces.
• Embedded Logic and Glue With 13,824 logic elements and 600,000 gates, the device is suitable for integrating custom logic, protocol conversion, and glue logic in embedded systems.
• Space-Constrained Systems The 256-LBGA surface-mount package supports compact PCB layouts where board real estate is limited.

Unique Advantages

• Balanced Logic and Memory: The combination of 13,824 logic elements and approximately 0.11 Mbits of embedded RAM lets designers implement moderate-complexity logic and local buffering without external memory.
• High I/O Count: 165 I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA fabric, reducing external glue components.
• Industrial-Grade Temperature Range: Operation from −40 °C to 100 °C supports deployments in environments that require extended temperature tolerance.
• Compact BGA Packaging: The 256-LBGA (256-FPBGA, 17×17) package enables high-density board layouts while maintaining a surface-mount assembly profile.
• RoHS Compliance: Conforms to RoHS requirements to align with modern manufacturing and environmental standards.

Why Choose A3PE600-1FGG256I?

The A3PE600-1FGG256I delivers a practical mix of logic density, embedded memory, and I/O resources in a compact 256-LBGA package, making it suitable for industrial and embedded designs that require robust operation across an extended temperature range. Its specification set supports integration of moderate-complexity custom logic, interface consolidation, and on-chip buffering without adding external components.

Backed by Microchip Technology and designed for surface-mount assembly, this device is aimed at engineers and procurement teams seeking an industrial-grade FPGA option that balances capacity, I/O flexibility, and packaging for reliable, long-term deployment.

Request a quote or contact sales to discuss pricing, lead times, and availability for the A3PE600-1FGG256I.