A3PE600-1FG484

The A3PE600-1FG484 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and a 270-pin I/O count in a compact 484-BGA package.

Designed for commercial-grade applications, this surface-mount device offers a balance of integration and I/O density with a 1.425 V to 1.575 V supply range and an operating temperature of 0 °C to 85 °C. RoHS compliance is included.

Key Features

• Core Logic  13,824 logic elements (LEs) and approximately 600,000 gates provide on-chip programmable logic capacity for moderate-complexity designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for localized data buffering and state storage.
• I/O Density  270 general-purpose I/O pins to support multiple interfaces and peripheral connections without external I/O expander devices.
• Package & Mounting  484-BGA (supplier package: 484-FPBGA 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Nominal supply voltage range of 1.425 V to 1.575 V to match low-voltage system domains.
• Environmental & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Embedded Control  Implement control logic and state machines where up to 13,824 logic elements and on-chip RAM are required.
• High‑I/O Systems  Support designs that need substantial external interfacing using the device’s 270 I/O pins.
• Compact Board Designs  Use the 484-BGA (23×23) package to integrate programmable logic into space-constrained PCBs with surface-mount assembly.

Unique Advantages

• Moderate-density programmable logic: 13,824 logic elements provide a clear capacity point for designs needing substantial on-chip logic without moving to larger families.
• On-chip memory for localized data: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for buffering and small lookup tables.
• High pin count for flexible interfacing: 270 I/O pins enable direct connections to multiple peripherals and buses, simplifying system design.
• Compact BGA package: 484-FPBGA (23×23) helps minimize board footprint while retaining good signal density for complex routing.
• Low-voltage operation: 1.425 V to 1.575 V supply compatibility supports integration into low-voltage digital domains.
• Commercial-grade and RoHS compliant: Fits standard commercial environments and meets RoHS requirements for regulatory compliance.

Why Choose A3PE600-1FG484?

The A3PE600-1FG484 combines a balanced mix of logic capacity, embedded memory, and I/O density in a compact 484-BGA surface-mount package, making it well suited for commercial embedded designs that require on-board programmability and significant peripheral connectivity. Its supply voltage range and operating temperature reflect compatibility with mainstream commercial systems.

As a Microchip Technology ProASIC3E device, it delivers a defined resource set—13,824 logic elements, 110,592 bits of RAM, 270 I/O—so engineers can match device capability to application needs while keeping board space and component count under control.

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