A3PE3000L-PQG208I

The A3PE3000L-PQG208I is a ProASIC3L family FPGA from Microchip Technology, delivered in a 208-BFQFP package. It provides a reprogrammable hardware fabric with substantial logic capacity, a large number of I/O, and embedded RAM to support custom digital designs in industrial environments.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 147 I/O pins, this device targets applications that require significant custom logic integration and industrial temperature operation while fitting in a 208-pin surface-mount footprint.

Key Features

• Logic Capacity  75,264 logic elements and 3,000,000 gates provide broad resources for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 0.52 Mbits (516,096 bits) of on-chip RAM to support data buffering, state storage, and local memory requirements.
• I/O Density  147 general-purpose I/O pins enable extensive interfacing to peripherals, sensors, and external devices.
• Power Supply Range  Operates from 1.14 V to 1.575 V supply rails to match system power architectures requiring this voltage range.
• Package and Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
• Industrial Temperature Grade  Specified operating temperature from -40 °C to 100 °C for operation in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Custom control logic and interfacing for factory automation and process control, leveraging the device's industrial temperature rating and large I/O count.
• Embedded Systems  Integration of application-specific logic and local memory for embedded designs that require on-chip programmability and moderate memory resources.
• Interface and Glue Logic  Replacement or consolidation of discrete interface components using the FPGA’s abundant logic elements and 147 I/O pins to simplify board-level designs.

Unique Advantages

• Substantial Logic Integration:  75,264 logic elements enable implementation of complex, multi-function designs on a single device, reducing external component count.
• On-Chip Memory:  Approximately 0.52 Mbits of embedded RAM provides local buffering and state storage without adding external memory.
• High I/O Count:  147 I/O pins support broad connectivity for sensors, actuators, and peripheral interfaces, minimizing the need for expanders.
• Industrial Temperature Support:  Rated from -40 °C to 100 °C for deployment in demanding temperature environments common in industrial applications.
• Compact Surface-Mount Package:  208-BFQFP (28×28) surface-mount package simplifies PCB layout and assembly for space-constrained designs.
• Regulatory Compliance:  RoHS compliance simplifies integration into designs with environmental compliance requirements.

Why Choose A3PE3000L-PQG208I?

The A3PE3000L-PQG208I combines a large pool of logic elements, embedded RAM, and a high I/O count in a surface-mount 208-pin package, making it well suited for industrial and embedded designs that demand on-device programmability and flexibility. Its operating voltage range and industrial temperature rating provide a clear fit where system-level integration and environmental robustness are required.

Designed by Microchip Technology, this device offers a balance of logic capacity, memory, and connectivity for customers building custom digital functions, interface consolidation, or embedded control systems that benefit from scalable FPGA resources and long-term platform availability.

Request a quote or submit an RFQ to receive pricing and availability information for the A3PE3000L-PQG208I.