A3PE3000L-FGG896M

The A3PE3000L-FGG896M is a ProASIC3L field programmable gate array from Microchip Technology designed for military-grade, high-reliability applications. It delivers a high logic capacity and dense I/O in a compact 896-ball BGA package, suitable for systems that require substantial on-chip logic and memory resources under demanding environmental conditions.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 620 I/O, this device targets designs that need significant integration and deterministic, qualified performance across a wide supply and temperature range.

Key Features

• Core Logic 75,264 logic elements (cells) providing substantial programmable logic capacity for complex designs.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) to support data buffering, state machines, and local storage.
• I/O Density 620 user I/O pins to accommodate wide parallel interfaces, high-channel-count sensor arrays, and complex board-level connectivity.
• Gate Count 3,000,000 gates enabling implementation of large logic functions and feature-rich systems.
• Power and Supply Operates from a supply range of 1.425 V to 1.575 V, facilitating predictable power design and integration.
• Package and Mounting 896-ball FBGA (31 × 31 mm) surface-mount package providing a compact, high-pin-count footprint for space-efficient PCB layouts.
• Qualification and Grade Military grade with MIL-STD-883 qualification and an operating temperature range of −55°C to 125°C for use in harsh and demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Military and Defense Systems — Suited for mission-critical logic, control, and interface functions where MIL-STD-883 qualification and wide temperature operation are required.
• High-Reliability Embedded Systems — Provides high logic capacity and on-chip RAM for embedded control, signal routing, and deterministic FPGA-based subsystems.
• High-Density I/O Platforms — The 620 I/O count supports applications requiring many parallel channels or diverse interface connectivity on a single device.
• Compact, High-Pin-Count Designs — 896-FBGA package allows dense integration on space-constrained PCBs while maintaining extensive I/O and logic resources.

Unique Advantages

• High Logic Density: 75,264 logic elements enable implementation of large, complex logic functions without external FPGA augmentation.
• Substantial On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state storage, reducing external memory dependency.
• Extensive I/O Capability: 620 I/O pins facilitate multi-channel interfaces and flexible board-level connectivity, simplifying system integration.
• Mil-Spec Qualification: MIL-STD-883 qualification and military grade classification provide traceable reliability credentials for high-reliability programs.
• Wide Temperature Range: Operation from −55°C to 125°C ensures performance across demanding environmental conditions.
• Compact Package: 896-FBGA (31 × 31 mm) surface-mount package balances high pin count with a space-efficient footprint for dense PCBs.

Why Choose A3PE3000L-FGG896M?

The A3PE3000L-FGG896M positions itself as a robust, high-capacity FPGA option for designers needing military-grade qualification, extensive logic resources, and a large number of I/O in a compact package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and MIL-STD-883 qualification make it well suited to long-life, high-reliability programs where environmental resilience and integration density matter.

Choose this device when your design requires scalable logic and memory on a qualified platform that supports dense connectivity and reliable operation across a wide supply and temperature envelope.

Request a quote or submit an inquiry to receive pricing and availability for the A3PE3000L-FGG896M and to discuss how it fits your next high-reliability design.