A3PE3000L-FGG484M

The A3PE3000L-FGG484M is a ProASIC3L Field Programmable Gate Array (FPGA) optimized for high-density digital designs requiring military-level qualification. It provides 75,264 logic elements, approximately 0.516 Mbits of embedded memory and a 341-pin I/O count to support complex processing, protocol bridging and dense I/O interfacing.

Designed and manufactured by Microchip Technology, this device is MIL-STD-883 qualified and rated for operation from -55°C to 125°C, making it suitable for defense and harsh-environment applications that require extended temperature range and formal military qualification.

Key Features

• Logic Capacity — 75,264 logic elements and approximately 3,000,000 gates to support complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Density — 341 available I/O pins to simplify board-level interfacing for multi-channel systems and high-pin-count peripherals.
• Package — 484-ball BGA in a 23×23 footprint (484-FPBGA) for a compact, high-pin-count surface-mount implementation.
• Power Supply — Specified operating supply range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Temperature & Reliability — Operating range of -55°C to 125°C and MIL-STD-883 qualification for military-grade reliability and environmental resilience.
• Compliance — RoHS compliant to meet environmental and lead-free requirements.

Typical Applications

• Military and Defense Systems — MIL-STD-883 qualification and extended temperature range make this FPGA suitable for rugged tactical and defense electronics.
• High-Density I/O Processing — 341 I/Os and large logic capacity support multi-channel interfaces, protocol translation and I/O-rich control systems.
• Complex Digital Processing — Large logic element count and embedded RAM enable implementation of sophisticated data-paths, custom accelerators and protocol engines.

Unique Advantages

• High Integration: Large logic element count and embedded memory reduce the need for external glue logic and discrete RAM, simplifying BOM and PCB routing.
• Military Qualification: MIL-STD-883 qualification and military grade rating reduce qualification overhead for defense programs.
• Wide Temperature Range: Specified -55°C to 125°C operation enables deployment in harsh and temperature-extreme environments.
• High I/O Count in Compact Package: 341 I/Os in a 484-FPBGA (23×23) package delivers dense connectivity in a space-efficient footprint.
• Predictable Power Window: Narrow core supply range (1.425 V–1.575 V) facilitates precise power supply design for reliable operation.
• Environmental Compliance: RoHS compliance supports lead-free assembly and environmental regulatory requirements.

Why Choose A3PE3000L-FGG484M?

The A3PE3000L-FGG484M is positioned for designs that demand a combination of high logic and I/O density with formal military qualification and extended-temperature capability. Its balance of logic elements, embedded memory and large I/O count makes it a strong fit for defense and other harsh-environment electronic systems requiring rugged, reliable FPGA solutions.

Backed by Microchip Technology manufacturing and MIL-STD-883 qualification, this device offers a predictable platform for long-term, high-reliability deployments where board-level integration, environmental resilience and component-level qualification are essential.

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