A3PE3000L-FGG324

The A3PE3000L-FGG324 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density programmable logic fabric with 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 221 user I/O pins, packaged in a compact 324-ball BGA.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.14 V to 1.575 V supply and across a 0 °C to 85 °C operating range, and is RoHS compliant.

Key Features

• Core Logic 75,264 logic elements (logic cells) providing the programmable resources to implement complex digital functions and 3,000,000 gates of logic capacity.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for data buffering, state storage and small lookup tables.
• I/O Density 221 user I/O pins to support a variety of external interfaces and system interconnections within a single device.
• Low-Voltage Core Core supply range of 1.14 V to 1.575 V to match low-voltage system domains and enable power-optimized designs.
• Compact Package 324-ball BGA in a 19 × 19 FBGA footprint (324-FBGA (19×19)), optimized for surface-mount PCB assembly and space-constrained designs.
• Commercial Temperature Range Rated for 0 °C to 85 °C operation and designated as commercial grade for general-purpose deployments.
• Environmentally Compliant RoHS compliant to meet common environmental and regulatory requirements.

Unique Advantages

• High logic density: 75,264 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Integrated memory resources: Approximately 0.52 Mbits of embedded RAM supports on-chip buffering and state machines without external memory.
• Substantial I/O capability: 221 I/Os allow flexible interfacing to peripherals, sensors and external logic while minimizing the need for I/O expanders.
• Space-efficient packaging: 324-BGA (19×19 FBGA) provides a compact footprint that helps optimize PCB area in dense designs.
• Low-voltage operation: Core supply range of 1.14 V–1.575 V aligns with modern low-power system domains for efficient integration.
• Regulatory readiness: RoHS compliance supports environmental requirements for commercial electronic products.

Why Choose A3PE3000L-FGG324?

The A3PE3000L-FGG324 is positioned for designers who need a commercially graded FPGA with substantial logic capacity, embedded memory and a high count of user I/Os in a compact BGA package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip RAM and a 221-pin I/O matrix makes it suitable for consolidating multiple digital subsystems into a single programmable device.

With low-voltage core operation and RoHS compliance, the device provides a balance of integration and regulatory readiness for commercial electronic designs where board space, I/O count and on-chip resources are priority considerations.

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