A3PE3000L-FG484M

The A3PE3000L-FG484M is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology designed for high-density programmable logic in military-grade applications. It combines millions of gates, a large population of logic elements, and substantial embedded memory with a wide operating temperature range and MIL-STD-883 qualification for demanding environments.

Key Features

• Core Logic — 3,000,000 gates and 75,264 logic elements to implement complex, high-density digital designs.
• Embedded Memory — Approximately 0.52 Mbits (516,096 bits) of on-chip RAM to support buffering, state storage, and local data handling.
• I/O Density — 341 I/O pins to support extensive interfacing and parallel system connections.
• Package & Mounting — 484-BGA package in a 484-FPBGA (23×23) footprint, designed for surface-mount assembly.
• Supply Voltage — Core supply range of 1.425 V to 1.575 V for integration into defined power domains.
• Rugged Qualification — Military grade with MIL-STD-883 qualification and an operating temperature range of −55 °C to 125 °C for deployment in harsh environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Military & Aerospace Systems — Military grade and MIL-STD-883 qualification combined with a −55 °C to 125 °C operating range support embedded logic functions in defense and aerospace platforms.
• Embedded Control & System Integration — High gate count and 75,264 logic elements enable implementation of complex control, glue logic, and custom processing blocks.
• High-density I/O Applications — 341 I/O pins provide the connectivity needed for multi-channel interfaces, parallel buses, and system-level integration tasks.

Unique Advantages

• High logic capacity: 3,000,000 gates and 75,264 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Extensive I/O: 341 I/Os enable direct connection to multiple subsystems, sensors, and interfaces without extensive external multiplexing.
• Rugged, qualified component: Military grade and MIL-STD-883 qualification, plus a −55 °C to 125 °C operating range, provide robustness for demanding operating environments.
• Compact BGA packaging: 484-FPBGA (23×23) in a surface-mount form factor supports high-density PCB designs while maintaining a small footprint.
• Controlled core voltage: Defined supply range (1.425 V to 1.575 V) helps simplify power domain planning in precision designs.

Why Choose A3PE3000L-FG484M?

The A3PE3000L-FG484M positions itself as a high-density, military-qualified FPGA option for designs that require significant programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. Its MIL-STD-883 qualification and wide operating temperature range make it suitable for projects that demand environmental resilience and long-term reliability.

Designed and manufactured by Microchip Technology, this FPGA is suitable for engineers and procurement teams building rugged embedded systems that need scalable logic capacity, dependable qualification, and compact surface-mount packaging.

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