A3PE3000L-FG484I

The A3PE3000L-FG484I is a ProASIC3L field-programmable gate array (FPGA) from Microchip Technology offered in a 484-ball fine-pitch BGA (23×23) surface-mount package. It provides a mid-to-high density fabric with 75,264 logic elements and approximately 0.52 Mbits of embedded RAM, plus 341 I/O pins and roughly 3,000,000 gates.

Designed for industrial applications, the device supports low-voltage operation from 1.14 V to 1.575 V and an operating range of −40 °C to 100 °C, delivering a compact, configurable platform for custom logic, I/O consolidation, and embedded-function integration.

Key Features

• Core Logic  75,264 logic elements providing the programmable resources to implement custom digital functions and glue logic within a single device.
• Gate Capacity  Approximately 3,000,000 gates to support complex designs and mid-density system integration.
• On-Chip Memory  Approximately 0.52 Mbits of embedded RAM for buffering, FIFOs, and small data tables without external memory.
• I/O  341 available I/O pins to drive multiple interfaces, sensors, and peripheral connections from a single package.
• Power  Supports a supply range of 1.14 V to 1.575 V to accommodate low-voltage system architectures.
• Package & Mounting  484-FPBGA (23×23) package in a surface-mount form factor for compact board-level integration.
• Industrial Temperature  Rated for −40 °C to 100 °C operation to meet the thermal requirements of industrial environments.
• Compliance  RoHS compliant to support environmentally conscious designs and manufacturing.

Typical Applications

• Industrial Control  Use the device’s logic density and wide temperature range to consolidate control, sequencing, and interfacing functions in automation systems.
• Communications and Networking  Leverage abundant I/O and gate capacity to implement custom protocol handling, data routing, or interface bridging in communications equipment.
• Custom Embedded Logic  Implement application-specific accelerators, data path logic, or protocol conversion within a single programmable device to simplify board design.
• Sensor and Instrumentation I/O  Use the high I/O count and on-chip RAM for signal conditioning, aggregation, and temporary data buffering in measurement systems.

Unique Advantages

• High Logic Density: 75,264 logic elements enable integration of multiple functions and complex state machines on a single FPGA, reducing external component count.
• Substantial Gate Count: Approximately 3,000,000 gates support sophisticated designs that require significant combinational and sequential resources.
• Generous I/O Capacity: 341 I/Os provide flexibility for diverse peripheral connections, multi-channel interfaces, and board-level consolidation.
• Compact BGA Packaging: The 484-FPBGA (23×23) surface-mount package balances density and board area for space-constrained designs.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in rugged or temperature-variable environments.
• RoHS Compliant: Environmentally compliant manufacturing support for global production requirements.

Why Choose A3PE3000L-FG484I?

The A3PE3000L-FG484I positions itself as a robust mid-to-high density FPGA option that balances logic capacity, I/O count, and embedded memory in a compact 484-BGA footprint. Its low-voltage supply range and industrial temperature rating make it suitable for embedded and industrial designs that demand configurable logic and reliable operation under varied environmental conditions.

Backed by Microchip Technology’s ProASIC3L family, this FPGA is a practical choice for engineers looking to consolidate custom logic, interface functions, and buffering into a single device—helping simplify board layouts and support scalable design choices across production runs.

Request a quote or submit a pricing inquiry to learn more about availability, lead times, and volume options for the A3PE3000L-FG484I.