A3PE3000L-FG484

IC FPGA 341 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

Quantity 109 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O341Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000L-FG484 – ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

The A3PE3000L-FG484 is a ProASIC3L FPGA from Microchip Technology, provided as a commercial-grade, surface-mount 484-BGA device. It delivers a programmable logic fabric with 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and a large 341-pin I/O complement for building complex, I/O-intensive designs.

With a gate capacity of 3,000,000 gates and an operating supply range of 1.14 V to 1.575 V, this device targets commercial embedded applications that require significant logic density, flexible I/O, and compact BGA packaging.

Key Features

  • Logic Capacity – 75,264 logic elements providing a programmable fabric suitable for complex digital functions and custom logic implementation.
  • On-Chip Memory – Approximately 0.52 Mbits of embedded RAM for data buffering, state storage, and intermediate processing.
  • Gate Count – 3,000,000 gates to support high-density logic designs and integration of multiple functions on a single device.
  • I/O Resources – 341 programmable I/O pins to accommodate extensive peripheral interfacing and multi-channel connectivity.
  • Package and Mounting – 484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for space-efficient board integration.
  • Power Supply – Operates from 1.14 V to 1.575 V, enabling deployment with system power rails in this voltage range.
  • Operating Temperature – Commercial temperature range of 0 °C to 85 °C for typical commercial-environment applications.
  • RoHS Compliance – Environmentally compliant manufacturing status.

Typical Applications

  • Commercial Embedded Systems – Implement custom control logic, peripheral bridging, and application-specific processing in space-constrained boards.
  • Communications Equipment – Use the high gate count and large I/O complement for protocol handling, data routing, and interface bridging in networked devices.
  • Instrumentation and Test Gear – Leverage the programmable logic and on-chip RAM for custom signal processing, data capture, and control functions.
  • Consumer and Industrial Devices (Commercial Grade) – Integrate device control, user interface logic, and multi-sensor aggregation in commercial-product designs.

Unique Advantages

  • High Logic Density: 75,264 logic elements and 3,000,000 gates provide capacity to integrate multiple functions that would otherwise require several discrete devices.
  • Ample On-Chip Memory: Approximately 0.52 Mbits of embedded RAM reduces the need for external memory for many buffering and fast-access tasks.
  • Extensive I/O: 341 I/O pins simplify board-level interfaces and allow direct connection to a wide range of peripherals and external components.
  • Compact BGA Package: 484-BGA (23 × 23) delivers a small board footprint for dense designs while supporting high pin count requirements.
  • Commercial Temperature Suitability: Rated from 0 °C to 85 °C for reliable operation in typical commercial environments.
  • Manufacturer Backing: Supplied by Microchip Technology and provided RoHS compliant to support environmentally conscious designs.

Why Choose A3PE3000L-FG484?

The A3PE3000L-FG484 balances high logic capacity, sizable embedded memory, and a broad I/O complement in a compact 484-BGA package, making it a practical choice for designers building commercial embedded systems that require substantial on-chip resources. Its power-supply range and commercial temperature rating align with typical system requirements, enabling straightforward integration into existing designs.

This device is suited for engineering teams that need to consolidate multiple digital functions into a single programmable device, reduce board-level component count, and maintain a compact form factor while relying on Microchip Technology’s FPGA offering and compliance with RoHS.

Request a quote or submit an inquiry to discuss availability, pricing, and how the A3PE3000L-FG484 can be incorporated into your next design.

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