A3PE3000L-FG896I

The A3PE3000L-FG896I is a ProASIC3L field programmable gate array (FPGA) manufactured by Microchip Technology. It provides a high-density programmable fabric with 75,264 logic elements and approximately 0.516 Mbits of embedded memory for configurable digital logic implementations.

Designed for industrial operation, the device offers a large I/O count and a compact 896-ball BGA package, with support for low-voltage core operation and extended temperature range to meet demanding system requirements.

Key Features

• Core and Logic 75,264 logic elements and approximately 3,000,000 gates provide significant on-chip programmable logic capacity for complex designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM bits for local data storage and buffering within the FPGA fabric.
• I/O Density Up to 620 I/O pins enable high-pin-count interfaces and flexible external connectivity.
• Power Supports a core voltage supply range from 1.14 V to 1.575 V for low-voltage logic operation.
• Package and Mounting 896-ball FBGA (31 × 31 mm) package in a surface-mount form factor suitable for compact board layouts.
• Operating Range Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant to support environmental and regulatory considerations.

Typical Applications

• High-pin-count digital systems — Designs requiring large numbers of external interfaces can leverage the device’s 620 I/Os for dense connectivity.
• Logic- and memory-intensive implementations — Use cases that need significant programmable logic and embedded RAM can take advantage of the 75,264 logic elements and ~0.516 Mbits of on-chip memory.
• Industrial-temperature deployments — Systems that operate across wide temperature ranges benefit from the −40 °C to 100 °C rating.

Unique Advantages

• High logic integration: 75,264 logic elements and 3,000,000 gates enable consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 0.516 Mbits of RAM bits support local buffering and state storage without external memory.
• Extensive I/O capability: 620 I/O pins provide flexibility for multi-channel interfaces and high-density peripheral connections.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial applications.
• Compact high-pin-count package: 896-FBGA (31 × 31 mm) offers a balance of pin density and board space efficiency for compact designs.
• Low-voltage core operation: Core supply range of 1.14 V to 1.575 V supports modern low-voltage design practices.

Why Choose A3PE3000L-FG896I?

The A3PE3000L-FG896I positions itself as a high-density, industrial-grade FPGA option for designs that require a large logic fabric, significant on-chip memory, and high I/O capacity in a compact BGA package. Its RoHS compliance and extended temperature rating make it suitable for deployments where environmental and thermal reliability are important.

This device is appropriate for engineering teams building complex programmable logic solutions that benefit from integrated memory, extensive connectivity, and low-voltage core operation, providing a scalable building block for diverse digital designs.

Request a quote or submit a purchase inquiry for A3PE3000L-FG896I to receive pricing and availability information.