A3PE3000L-FGG484

The A3PE3000L-FGG484 is a ProASIC3L FPGA from Microchip Technology designed for commercial embedded and digital logic applications. It provides a high-density programmable fabric with 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 3,000,000 gates to support complex custom logic and interface aggregation.

Packaged in a 484-ball BGA (484-FPBGA, 23×23) and supporting 341 I/O pins, the device is optimized for compact board-level integration where a large number of I/Os and logic resources must be delivered within a surface-mount footprint. It operates over a 1.14 V to 1.575 V supply range and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 75,264 logic elements (cells) and approximately 3,000,000 gates for high-density programmable logic implementation.
• Embedded Memory  Includes approximately 516,096 bits of on-chip RAM to implement FIFOs, buffers and small data structures without external memory.
• I/O Resources  Offers 341 device I/O pins to support dense interface requirements and multiple peripheral connections.
• Power and Voltage  Operates across a 1.14 V to 1.575 V supply range to match low-voltage system rails.
• Package and Mounting  484-ball FBGA package (484-FPBGA, 23×23) in a surface-mount format for compact board-level integration.
• Temperature and Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory adherence in commercial products.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, glue logic and protocol adaptation within consumer and business electronics.
• Communications Equipment  Aggregate and route multiple I/O signals and implement protocol-specific logic blocks in networking or telecom gear.
• Test and Measurement  Provide flexible digital I/O, data buffering and pattern generation for bench instruments and automated test equipment.
• Prototyping and Development  Use the device’s logic density and I/O count to evaluate and iterate complex digital designs prior to final integration.

Unique Advantages

• High Logic Density: 75,264 logic elements enable implementation of complex state machines, datapaths and custom accelerators on a single device.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O Availability: 341 I/O pins support multiple interfaces and high-pin-count connectivity without external multiplexing.
• Compact BGA Footprint: 484-FPBGA (23×23) package delivers high pin count in a surface-mount form factor for space-constrained PCBs.
• Commercial Temperature Coverage: Rated for 0 °C to 85 °C to meet typical commercial product requirements.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronic products.

Why Choose A3PE3000L-FGG484?

The A3PE3000L-FGG484 balances significant logic capacity, on-chip memory and a high I/O count in a compact 484-BGA package, making it a practical choice for commercial designs that require dense programmable logic and flexible interfacing. Its operating voltage range and commercial temperature rating align with common system rails and environments for consumer and business electronics.

This device is suitable for engineers and procurement teams seeking a Microchip ProASIC3L FPGA with strong integration potential—reducing board-level complexity while providing the resources needed for sophisticated digital designs. RoHS compliance and surface-mount packaging further support streamlined manufacturing and assembly.

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